公开(公告)号：US20200008293A1

公开(公告)日：2020-01-02

申请号：US16485340

申请日：2018-02-06

Applicant: ZF Friedrichshafen AG

Inventor： Michael SPERBER

IPC: H05K1/02 ,  H05K1/11 ,  H05K5/00

Abstract: A multi-layer circuit board comprising a carrier plate with an upper surface and a lower surface, and at least one electrically conductive upper inner layer located on the upper surface of the carrier plate and an electrically insulating upper intermediate layer located thereon, and an electrically conductive upper outer layer located thereon, forming the outermost layer of the upper surface. At least one electrically conductive lower inner layer is located on the lower surface of the carrier plate and an electrically insulating lower intermediate layer located thereon, and an electrically conductive lower outer layer located thereon, forming the outermost layer of the lower surface. The upper and/or lower outer layers are populated with components, and conductor paths in one of the inner layers are oriented in different directions from conductor paths in the other inner layer, and the region between the conductor paths is flooded with a voltage.

公开(公告)号：US20160286639A1

公开(公告)日：2016-09-29

申请号：US15037266

申请日：2014-10-21

Applicant: ZF FRIEDRICHSHAFEN AG

Inventor： Wilfried LASSMANN ,  Michael SPERBER

IPC: H05K1/02 ,  H01L23/552 ,  H05K1/09 ,  H01L23/498

CPC classification number: H05K1/0265 ,  H01L23/49822 ,  H01L23/552 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/09 ,  H05K2201/0723 ,  H05K2201/09254 ,  H05K2201/09327 ,  H05K2201/09736 ,  H05K2201/10053 ,  H05K2201/10166 ,  H01L2924/00

Abstract: A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.

Abstract translation: 多功能高电流电路板包括具有用于传导电流的多个层的导电层，包括用于切换电负载的至少一个电源断路器的开关层，包括至少一个控制元件的控制层，以控制 至少一个电源断路器，用于屏蔽电流传导层与控制层和开关层的至少一个屏蔽元件。

公开(公告)号：US20210392791A1

公开(公告)日：2021-12-16

申请号：US17348092

申请日：2021-06-15

Applicant: ZF Friedrichshafen AG

Inventor： Michael SPERBER ,  Thomas Schupp ,  Christian Schanda

IPC: H05K7/20 ,  H05K1/02

Abstract: A power module for operating an electric vehicle drive, comprising power switches for generating an output current based on an input current; control electronics for controlling the power switches including a first region, to which a first electric potential is applied, and a second region, to which a second electric potential is applied, wherein the second electric potential is higher than the first electric potential; a heatsink for discharging heat generated by the power switches and the control electronics; a shielding layer for electrically shielding the control electronics placed between the heatsink and the control electronics, such that the control electronics lies on the shielding layer, and the shielding layer lies on the heatsink; wherein the shielding layer is designed to connect the heatsink thermally and electrically to the first region, and thermally to the second region, and electrically insulate it therefrom.

公开(公告)号：US20210014999A1

公开(公告)日：2021-01-14

申请号：US16969877

申请日：2019-02-05

Applicant: ZF Friedrichshafen AG

Inventor： Marco DENK ,  Johannes HAGER ,  Michael SPERBER

IPC: H05K7/20 ,  H02M7/00

Abstract: A power electronics assembly comprises a heat sink, at least two half bridge modules mounted on one side of the heat sink, a circuit board mounted on the half bridge modules, and at least one capacitor mounted on the circuit boards, wherein each of the half bridge modules has a housing that has a cold side that is mounted on the heat sink, and the housing has a connection side from which numerous connection pins project for each DC connection in the half bridge module that are connected to the circuit board, and wherein conductors in the circuit board are designed to connect the half bridge modules in parallel and connect them to the at least one capacitor to form a DC link.