公开(公告)号：US20170042018A1

公开(公告)日：2017-02-09

申请号：US15106339

申请日：2014-06-09

Applicant: ZTE Corporation

Inventor： Yunyun LONG

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/0209 ,  H05K1/18 ,  H05K7/20445 ,  H05K9/0032 ,  H05K2201/10371

Abstract: A dual layer shielding cover is provided and includes a dual layer structure with an upper layer shielding cover (22) and a lower layer shielding cover (21). The dual layer shielding cover is formed by stamping through a mould, for example, formed by bending and stretching, etc.

Abstract translation: 提供双层屏蔽盖，并且包括具有上层屏蔽盖（22）和下层屏蔽盖（21）的双层结构。 双层屏蔽罩通过冲压通过模具形成，例如通过弯曲和拉伸等形成。