公开(公告)号：US20210092840A1

公开(公告)日：2021-03-25

申请号：US16683741

申请日：2019-11-14

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SHENG-FENG CHUNG ,  CHEN-FENG YEN ,  BO-HONG ZHOU

IPC: H05K1/09 ,  C08G59/00 ,  C08K9/02 ,  C08K3/08 ,  C08J5/18 ,  H05K3/40 ,  H01B1/22

Abstract: A durable but thin-film conductive composition of increased flexibility comprises about 90 parts by weight to about 110 parts by weight of a thermosetting resin, about 900 parts by weight to about 1100 parts by weight of a conductive agent, about 10 parts by weight to about 15 parts by weight of a hardener, and about 0 part by weight to about 50 parts by weight of a thixotropic agent. The disclosure further provides a conductive film formed by heating and curing the conductive composition and a circuit board with several circuit layers joined by the conductive film.