公开(公告)号：US20180188649A1

公开(公告)日：2018-07-05

申请号：US15691282

申请日：2017-08-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： CHEN-FENG YEN ,  CHANG-HUNG LEE ,  YI-FANG LIN ,  YEN-CHIN HSIAO ,  SHOU-JUI HSIANG ,  MAO-FENG HSU

IPC: G03F7/029 ,  H05K1/03

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

公开(公告)号：US20170275508A1

公开(公告)日：2017-09-28

申请号：US15191516

申请日：2016-06-23

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： MAO-FENG HSU ,  CHEN-FENG YEN ,  YEN-CHIN HSIAO

IPC: C09J133/00 ,  C09J11/08 ,  C09J7/02 ,  H05K1/03 ,  B32B7/12 ,  B32B27/42 ,  B32B27/38 ,  C09J9/00 ,  C08L33/00

CPC classification number: C09J133/00 ,  B32B7/12 ,  B32B27/38 ,  B32B27/42 ,  B32B2457/08 ,  C08L33/00 ,  C08L33/02 ,  C08L63/00 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2207/53 ,  C09J9/00 ,  C09J11/08 ,  C09J133/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  H05K1/0326 ,  H05K1/0353 ,  H05K2201/0195

Abstract: A resin composition suitable as an adhesive layer and as a circuit board substrate includes an acrylic resin, a non-photosensitive resin with carboxyl groups, nano core-shell particles, a photoinitiator, and a solvent, such adhesive layer and circuit board substrate being high-strength and temperature-resistant whilst retaining flexibility. The acrylic resin is in an amount by weight of 150 parts in the resin composition, the non-photosensitive resin is in an amount by weight of 30 parts to 80 parts in the resin composition, the nano core-shell particles are in an amount by weight of 5 parts to 30 parts in the resin composition, and the photoinitiator is in an amount by weight of 1 part to 10 parts in the resin composition.

公开(公告)号：US20220039303A1

公开(公告)日：2022-02-03

申请号：US16996705

申请日：2020-08-18

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SHENG-FENG CHUNG ,  CHI-FEI HUANG ,  CHEN-FENG YEN

IPC: H05K9/00 ,  B41M3/00 ,  B41M7/00 ,  C09D11/52 ,  C09D11/322 ,  C09D11/36 ,  C09D11/037 ,  C09D11/033 ,  C09D11/102

Abstract: A method for manufacturing an electromagnetic shielding film of reduced thickness and a simplified manufacturing process includes forming a conductive ink layer by inkjet printing, on a component to be shielded, forming an insulative ink layer on the conductive ink layer by inkjet printing, and sintering the conductive ink layer and the insulative ink layer to form an electromagnetic shielding layer and an insulative layer, thereby obtaining the electromagnetic shielding film.

公开(公告)号：US20210092840A1

公开(公告)日：2021-03-25

申请号：US16683741

申请日：2019-11-14

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SHENG-FENG CHUNG ,  CHEN-FENG YEN ,  BO-HONG ZHOU

IPC: H05K1/09 ,  C08G59/00 ,  C08K9/02 ,  C08K3/08 ,  C08J5/18 ,  H05K3/40 ,  H01B1/22

Abstract: A durable but thin-film conductive composition of increased flexibility comprises about 90 parts by weight to about 110 parts by weight of a thermosetting resin, about 900 parts by weight to about 1100 parts by weight of a conductive agent, about 10 parts by weight to about 15 parts by weight of a hardener, and about 0 part by weight to about 50 parts by weight of a thixotropic agent. The disclosure further provides a conductive film formed by heating and curing the conductive composition and a circuit board with several circuit layers joined by the conductive film.

公开(公告)号：US20180203350A1

公开(公告)日：2018-07-19

申请号：US15482946

申请日：2017-04-10

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MAO-FENG HSU ,  CHEN-FENG YEN ,  SHOU-JUI HSIANG ,  YEN-CHIN HSIAO

IPC: G03F7/031 ,  G03F7/004 ,  G03F7/039 ,  G03F7/038 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H05K3/00

CPC classification number: G03F7/031 ,  G03F7/105 ,  G03F7/40 ,  H05K3/287

Abstract: A photosensitive resin composition which is non-reactive and thus storable at a normal temperatures includes 100 parts (by weight) of an epoxy acrylate, 10-50 parts acrylate monomers, 1-40 parts acrylate oligomers, 5-15 parts of a photoinitiator, 1-5 parts of a coloring agent, and 10-50 parts of a blocked polyisocyanate. A method of making and a printed circuit board made accordingly are also disclosed.

公开(公告)号：US20170362361A1

公开(公告)日：2017-12-21

申请号：US15484135

申请日：2017-04-11

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MAO-FENG HSU ,  CHEN-FENG YEN ,  SHOU-JUI HSIANG ,  YEN-CHIN HSIAO

IPC: C08F220/32 ,  G03F7/11 ,  G03F7/029 ,  H05K1/03 ,  H05K3/46

CPC classification number: C08F220/32 ,  C08F2/48 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/11 ,  H05K1/0373 ,  H05K3/064 ,  H05K3/287 ,  H05K3/46 ,  H05K2201/0104 ,  H05K2203/056 ,  C08F2222/1086 ,  C08F2222/1026 ,  C08F222/1006

Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.