公开(公告)号：US20140185257A1

公开(公告)日：2014-07-03

申请号：US14138126

申请日：2013-12-23

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Shih-Ping HSU

IPC: H05K3/34 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/186 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09072 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer.

Abstract translation: 具有嵌入式部件的印刷电路板包括双面印刷电路板，电子部件，多个导电浆料块，绝缘层和第一布线层附近的布线层，绝缘层和靠近第二布线层的布线层 接线层。 所述双面印刷电路板包括第一布线层，基底和第二布线层。 第一布线层和第二布线层布置在基底的相对侧上。 第二布线层包括多个电接触垫。 基座定义了多个导电通孔。 每个电接触焊盘与一个对应的导电通孔对准并电连接。 导电膏块电连接到导电通孔。 电子元件电连接到导电膏块。 两个绝缘层覆盖电子部件和第二布线层。