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公开(公告)号:US20240055464A1
公开(公告)日:2024-02-15
申请号:US18255110
申请日:2021-11-23
Applicant: ams-OSRAM AG
Inventor: José Manuel GARCÍA GONZÁLEZ , Joel BERTOMEU MESTRE , Harald ETSCHMAIER , Rafael SERRANO GOTARREDONA
IPC: H01L27/146 , G01T1/24 , A61B6/00 , H04N25/30 , H04N25/78
CPC classification number: H01L27/14659 , G01T1/247 , A61B6/4233 , H04N25/30 , H04N25/78
Abstract: An X-ray radiation sensor device may include a direct X-ray conversion layer, a plurality of electrodes to provide an electric charge in response to an interaction of an X-ray photon within the direct X-ray conversion layer, a plurality of pixel sensor arrays, and at least one interposer. The direct X-ray conversion layer and the plurality of electrodes are disposed on the top surface of the interposer(s). The plurality of the pixel sensor arrays is disposed on the bottom surface of the interposer(s), and the interposer(s) is configured to electrically couple each of the pixel sensor arrays to a respective portion of the plurality of electrodes.
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公开(公告)号:US20230411434A1
公开(公告)日:2023-12-21
申请号:US18251745
申请日:2021-11-11
Applicant: ams-Osram AG
Inventor: Eduard STADLER , Harald ETSCHMAIER , Josef PERTL , Fabian HUBER
IPC: H01L27/146 , G01T1/24 , G01T1/20 , A61B6/03 , H01L25/065
CPC classification number: H01L27/14661 , G01T1/24 , G01T1/2018 , A61B6/032 , H01L25/0655 , H01L27/14636 , H01L27/1469 , H01L27/14659
Abstract: A module assembly for the detection of X-ray radiation includes an X-ray sensor being configured to receive a photon of the X-ray radiation and to provide an electrical signal in response to the received photon. The module assembly further includes a system-in-package structure for processing the electrical signal, the system-in-package structure including an input/output terminal, a first interposer and a second interposer and an integrated circuit which are arranged in a stacked configuration in the system-in-package structure. The package structure can be assembled on all four lateral sides and is thus four-side buttable so that contiguous modules can be mounted on all four sides without a gap between pixels to read out data from large-pixelated detectors of the X-ray sensor.
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