公开(公告)号：US20140374866A1

公开(公告)日：2014-12-25

申请号：US14295451

申请日：2014-06-04

Applicant: uPI semiconductor corp.

Inventor： Ping-Yuan Lin

IPC: H01L27/144 ,  H01L31/18

CPC classification number: H01L27/1461 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14647 ,  H01L27/14689

Abstract: A photo sensing chip and a manufacturing method thereof are disclosed. The photo sensing chip includes a silicon substrate and a plurality of photo sensors formed on the silicon substrate. The photo sensors include a first photo sensor and a second photo sensor. The first photo sensor has a first P-N junction and a first depletion region is formed at first P-N junction for receiving a first light band of an incident light to generate a first photo current. The second photo sensor has a second P-N junction and a second depletion region is formed at second P-N junction for receiving a second light band of the incident light to generate a second photo current. A first process parameter corresponds to the first depletion region and a second process parameter corresponds to the second depletion region, wherein the first process parameter and the second process parameter are different.

Abstract translation: 公开了一种感光芯片及其制造方法。 感光芯片包括形成在硅衬底上的硅衬底和多个光电传感器。 光传感器包括第一光传感器和第二光传感器。 第一光传感器具有第一P-N结，并且在第一P-N结处形成第一耗尽区，用于接收入射光的第一光带以产生第一光电流。 第二光传感器具有第二P-N结，在第二P-N结处形成第二耗尽区，用于接收入射光的第二光带以产生第二光电流。 第一处理参数对应于第一耗尽区域，第二处理参数对应于第二耗尽区域，其中第一处理参数和第二处理参数不同。

公开(公告)号：US09130086B2

公开(公告)日：2015-09-08

申请号：US14305043

申请日：2014-06-16

Applicant: uPI semiconductor corp.

Inventor： Ping-Yuan Lin

IPC: H01L31/20 ,  H01L31/0376 ,  H01L31/105

CPC classification number: H01L31/03762 ,  H01L31/02005 ,  H01L31/02327 ,  H01L31/1055 ,  H01L31/202 ,  Y02E10/50 ,  Y02P70/521

Abstract: A light sensor and a manufacturing method thereof are disclosed. The light sensor is capable of being coupled to a carry object and includes a sensing chip and a plurality of conductive connecting elements. The sensing chip includes a first surface and a second surface opposite to each other. The sensing chip also includes a sensing unit disposed between the first surface and the second surface and at least partially exposed by a window formed on the second surface. The first surface faces the carry object when the light sensor is coupled to a carry object. The conductive connecting elements are disposed on the first surface and coupled to the sensing unit in order to couple the light sensor to the carry object.

Abstract translation: 公开了一种光传感器及其制造方法。 光传感器能够耦合到携带物体并且包括感测芯片和多个导电连接元件。 感测芯片包括彼此相对的第一表面和第二表面。 感测芯片还包括设置在第一表面和第二表面之间并且由形成在第二表面上的窗口至少部分地暴露的感测单元。 当光传感器耦合到携带物体时，第一表面面向携带物体。 导电连接元件设置在第一表面上并且耦合到感测单元，以将光传感器耦合到携带物体。

公开(公告)号：US20150048374A1

公开(公告)日：2015-02-19

申请号：US14305043

申请日：2014-06-16

Applicant: uPI semiconductor corp.

Inventor： Ping-Yuan Lin

IPC: H01L31/0376 ,  H01L31/20 ,  H01L31/105

CPC classification number: H01L31/03762 ,  H01L31/02005 ,  H01L31/02327 ,  H01L31/1055 ,  H01L31/202 ,  Y02E10/50 ,  Y02P70/521

Abstract: A light sensor and a manufacturing method thereof are disclosed. The light sensor is capable of being coupled to a carry object and includes a sensing chip and a plurality of conductive connecting elements. The sensing chip includes a first surface and a second surface opposite to each other. The sensing chip also includes a sensing unit disposed between the first surface and the second surface and at least partially exposed by a window formed on the second surface. The first surface faces the carry object when the light sensor is coupled to a carry object. The conductive connecting elements are disposed on the first surface and coupled to the sensing unit in order to couple the light sensor to the carry object.

Abstract translation: 公开了一种光传感器及其制造方法。 光传感器能够耦合到携带物体并且包括感测芯片和多个导电连接元件。 感测芯片包括彼此相对的第一表面和第二表面。 感测芯片还包括设置在第一表面和第二表面之间并且由形成在第二表面上的窗口至少部分地暴露的感测单元。 当光传感器耦合到携带物体时，第一表面面向携带物体。 导电连接元件设置在第一表面上并且耦合到感测单元，以将光传感器耦合到携带物体。

公开(公告)号：US20140131551A1

公开(公告)日：2014-05-15

申请号：US14072864

申请日：2013-11-06

Applicant: uPI Semiconductor Corp.

Inventor： Ping-Yuan Lin ,  Chih-Chang Wei

IPC: G01S7/497

CPC classification number: G01S7/497 ,  G01S7/4813 ,  G01S17/026

Abstract: A proximity sensor includes a proximity sensing unit and a signal processing unit. The proximity sensing unit detects whether an object to be detected is close by to obtain a measured value. The signal processing unit compares the measured value with an initial noise cross-talk value to determine whether the initial noise cross-talk value should be updated. If the determined result of the signal processing unit is no, the signal processing unit compares the measured value with a default value to determine whether the object to be detected is located in a detection range of the proximity sensing unit.

Abstract translation: 接近传感器包括接近感测单元和信号处理单元。 接近感测单元检测待检测物体是否靠近以获得测量值。 信号处理单元将测量值与初始噪声串扰值进行比较，以确定是否应更新初始噪声串扰值。 如果信号处理单元的确定结果为否，则信号处理单元将测量值与默认值进行比较，以确定被检测对象是否位于接近感测单元的检测范围内。

公开(公告)号：US20140061444A1

公开(公告)日：2014-03-06

申请号：US14018530

申请日：2013-09-05

Applicant: uPI Semiconductor Corp.

Inventor： Kun-Chang Wang ,  Ping-Yuan Lin

IPC: G01S17/02

CPC classification number: G01S17/026 ,  G01S7/4813 ,  Y10T29/49117

Abstract: A proximity sensor package and a packaging method thereof are disclosed. The proximity sensor package includes a light emitting unit and a light sensor. The light sensor has a first surface having a light sensing area. The light emitting unit is disposed on the first surface of the light sensor outside the light sensing area.

Abstract translation: 公开了一种接近传感器封装及其封装方法。 接近传感器封装包括发光单元和光传感器。 光传感器具有具有光感测区域的第一表面。 发光单元设置在光传感器外部的光传感器的第一表面上。

公开(公告)号：US20140097451A1

公开(公告)日：2014-04-10

申请号：US14038818

申请日：2013-09-27

Applicant: uPI Semiconductor Corp.

Inventor： Ping-Yuan Lin

IPC: H01L25/00 ,  H01L25/16

CPC classification number: H01L25/50 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A proximity sensor and a circuit layout method thereof are disclosed. The proximity sensor includes a light sensor and a light emitting unit. The light sensor includes a semiconductor substrate and a bonding pad. The semiconductor substrate has a first circuit region. At least one semiconductor device is disposed in the first circuit region. The bonding pad is disposed above the first circuit region and a gap is existed between the bonding pad and the at least one semiconductor device. The bonding pad is connected to the semiconductor substrate out of the first circuit region. The light emitting unit is disposed on the bonding pad of the light sensor.

Abstract translation: 公开了一种接近传感器及其电路布局方法。 接近传感器包括光传感器和发光单元。 光传感器包括半导体衬底和接合焊盘。 半导体衬底具有第一电路区域。 至少一个半导体器件设置在第一电路区域中。 接合焊盘设置在第一电路区域上方，并且在焊盘和至少一个半导体器件之间存在间隙。 接合焊盘从第一电路区域连接到半导体衬底。 发光单元设置在光传感器的接合焊盘上。