Thermosensitive composition
    1.
    发明授权
    Thermosensitive composition 失效
    热敏组合物

    公开(公告)号:US6063528A

    公开(公告)日:2000-05-16

    申请号:US859681

    申请日:1997-05-20

    Inventor: David A. Morgan

    Abstract: A thermosensitive composition consisting of a mixture of polyacrylic acid, a salt of a long chain fatty acid such as silver behenate, an infra-red absorbent and modifiers such as additional polymers and fillers. Both the water solubility and affinity to water and oil are changed when composition is heated.

    Abstract translation: 由聚丙烯酸,长链脂肪酸的盐如山嵛酸银的混合物,红外吸收剂和改性剂如其它聚合物和填料组成的热敏组合物。 当组合物加热时,水溶性和对水和油的亲和力都会改变。

    Thermosensitive etch resist for forming a mask
    2.
    发明授权
    Thermosensitive etch resist for forming a mask 失效
    用于形成掩模的热敏蚀刻抗蚀剂

    公开(公告)号:US5958647A

    公开(公告)日:1999-09-28

    申请号:US858977

    申请日:1997-05-20

    Inventor: David A. Morgan

    CPC classification number: H05K3/064 G03C1/4989 H05K2201/0112 H05K2203/107

    Abstract: A thermosensitive resist used in the manufacturing of printed circuit boards comprising a mixture of polyacrylic acid, a salt of a long chain fatty acid such as silver behenate, an infra-red absorber and modifiers such as additional polymers. In the unheated form the resist can be easily washed away with water-based mild solutions or pure water. When selectively heated by an IR laser a non-soluble, etch resistant composition is formed protecting the copper clad printed circuit board from the etchants used in the process.

    Abstract translation: 用于制造印刷电路板的热敏抗蚀剂,其包含聚丙烯酸,长链脂肪酸的盐如山嵛酸银的混合物,红外吸收剂和诸如另外的聚合物的改性剂的混合物。 在未加热的形式中,抗蚀剂可以容易地用水基温和溶液或纯水冲洗掉。 当通过IR激光器选择性加热时,形成不可蚀刻的耐蚀刻组合物,以保护铜包覆印刷电路板免受在该工艺中使用的蚀刻剂的影响。

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