Abstract:
A material handling system for a table saw that controls the orientation and speed of material as it moves through the system. The material handling system includes an idler device having upper and lower support surfaces configured to maintain a piece of processed material in the processing path until it substantially passes the upper support surface. The material handling system includes a ramp configured to deliver a piece of processed material from the processing path to a return conveyor.
Abstract:
A thermosensitive composition consisting of a mixture of polyacrylic acid, a salt of a long chain fatty acid such as silver behenate, an infra-red absorbent and modifiers such as additional polymers and fillers. Both the water solubility and affinity to water and oil are changed when composition is heated.
Abstract:
A thermosensitive resist used in the manufacturing of printed circuit boards comprising a mixture of polyacrylic acid, a salt of a long chain fatty acid such as silver behenate, an infra-red absorber and modifiers such as additional polymers. In the unheated form the resist can be easily washed away with water-based mild solutions or pure water. When selectively heated by an IR laser a non-soluble, etch resistant composition is formed protecting the copper clad printed circuit board from the etchants used in the process.
Abstract:
Systems, including method and apparatus, for processing workpieces driven automatically along a linear path to a plurality of positions disposed substantially along the linear path. In some embodiments, a workpiece may be processed at one or more of the positions using two or more processing stations, such as a first processing station that cuts the workpiece into segments and a second processing station that performs another processing operation on the workpiece.
Abstract:
A system, including apparatus and method, for processing material includes a computer connected to a saw. A pusher is used to convey material along a processing path. The computer is programmed to control optimal processing of material to satisfy a cut list. The system for processing material may further include a printer configured to print labels for application to work pieces processed by the system.
Abstract:
A method of circuit design for designing integrated circuits with one or more embedded memories. A placement is generated for timing critical logic associated with each included embedded memory in a logic design. An augmented memory boundary is generated for said each included memory. Each augmented memory boundary encompasses one embedded memory and associated said timing critical logic.
Abstract:
A marking assembly for marking feature locations of a material and an automated processing system that uses input from the marking assembly to process the material. Feature locations such as defect positions and the size of the material are measured with an optical measuring device. The optical measuring device sends and receives light along a light path that is substantially parallel to a processing dimension of the material. A user manually interrupts the light path at a feature location, sending light from the feature location to the optical measuring device. The optical measuring device measures the feature location from the light received from the feature location and sends the feature location to a processor. The processor automatically positions the material relative to a modifying device, based on the feature location.
Abstract:
Gauge system, including methods and apparatus, for positioning workpieces to be processed. In some embodiments, the gauge system may have a plurality of stops for positioning the end of a workpiece at distinct distances from a processing station. In some embodiments, the plurality of stops may be arrayed along a rail assembly having an adjustable length.
Abstract:
Systems, including method and apparatus, for processing workpieces driven automatically along a linear path to a plurality of positions disposed substantially along the linear path. In some embodiments, a workpiece may be processed at one or more of the positions using two or more processing stations, such as a first processing station that cuts the workpiece into segments and a second processing station that performs another processing operation on the workpiece.
Abstract:
Systems, including method and apparatus, for processing workpieces driven automatically along a linear path to a plurality of positions disposed substantially along the linear path. In some embodiments, a workpiece may be processed at one or more of the positions using two or more processing stations, such as a first processing station that cuts the workpiece into segments and a second processing station that performs another processing operation on the workpiece.