Chemical liquid receiving assembly and apparatus for supplying chemical liquid

    公开(公告)号:US11975349B2

    公开(公告)日:2024-05-07

    申请号:US17457947

    申请日:2021-12-07

    CPC classification number: B05C11/1007 B05B9/03

    Abstract: An apparatus for supplying chemical liquid may include a chemical liquid supply member for supplying a chemical liquid onto a substrate, a chemical liquid storing member for storing the chemical liquid, a chemical liquid receiving assembly for receiving the chemical liquid provided from the chemical liquid storing member and for providing the chemical liquid into the chemical liquid supply member, a first chemical liquid supply line for supplying the chemical liquid from the chemical liquid storing member to the chemical liquid receiving assembly, and a second chemical liquid supply line for supplying the chemical liquid from the chemical liquid receiving assembly to the chemical liquid supply member.

    SLURRY DISPENSING APPARATUS FOR EMI SHIELDING

    公开(公告)号:US20180035575A1

    公开(公告)日:2018-02-01

    申请号:US15663823

    申请日:2017-07-31

    Inventor: SEUNG MIN HONG

    CPC classification number: H05K9/0083 B05C5/02 B05C5/0225 B05C11/1007 B05C11/11

    Abstract: Provided is a slurry dispensing apparatus for electromagnetic interference (EMI) shielding, and more particularly, a slurry dispensing apparatus for EMI shielding, wherein the slurry dispensing apparatus dispenses a slurry, in which a conductive metal powder and an adhesive are mixed, to an electronic component to form an electromagnetic wave shielding layer on the electronic component.By using the slurry dispensing apparatus for EMI shielding, the slurry may be dispensed while preventing separation of the metal powder included in the slurry from the adhesive by precipitation, and maintaining a uniform mixture ratio in the slurry.

    Microfluidic surface processing device and method
    8.
    发明授权
    Microfluidic surface processing device and method 有权
    微流体表面处理装置及方法

    公开(公告)号:US09289794B2

    公开(公告)日:2016-03-22

    申请号:US13928604

    申请日:2013-06-27

    Abstract: The present invention is notably directed to a microfluidic surface processing device including a microfluidic probe head with at least one aperture, on a face, including at least an outlet aperture; and a surface processing structure extending outward and perpendicular with respect to the face, the processing structure being further dimensioned and located with respect to the outlet aperture such that it can intercept a flowpath of liquid dispensed via the outlet aperture. The present invention is further directed to related apparatuses and methods.

    Abstract translation: 本发明特别涉及一种微流体表面处理装置,其包括具有至少一个孔的微流体探针头,其表面包括至少一个出口孔; 以及相对于所述面向外且垂直延伸的表面处理结构,所述处理结构相对于所述出口孔进一步确定尺寸并定位成使得其可以拦截经由所述出口孔分配的液体的流路。 本发明进一步涉及相关的装置和方法。

    Adhesive dispensing system and method using smart melt heater control
    9.
    发明授权
    Adhesive dispensing system and method using smart melt heater control 有权
    粘合剂分配系统和使用智能熔体加热器控制的方法

    公开(公告)号:US09200741B2

    公开(公告)日:2015-12-01

    申请号:US13799737

    申请日:2013-03-13

    Abstract: An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.

    Abstract translation: 粘合剂分配系统被配置为自动降低粘合剂材料的温度,以减少由于在低生产量期间将粘合剂保持在施加温度下导致的粘合剂降解。 为此,系统的控制器操作加热器单元以将单元设定点温度保持在热和熔融粘合剂中,直到从填充系统最近向系统供应粘合剂而经过设定的阈值时间。 一旦从最近的粘合剂供应超过设定的阈值时间过去的时间,加热器单元的温度降低以降低粘合剂的温度。 这种降低是足够大的温度以使降解和脱气最小化,但足够小以便在新的粘合剂出现之后能够实现快速的预热时间。

    ADHESIVE DISPENSING SYSTEM AND METHOD USING SMART MELT HEATER CONTROL
    10.
    发明申请
    ADHESIVE DISPENSING SYSTEM AND METHOD USING SMART MELT HEATER CONTROL 有权
    胶粘剂分配系统和使用智能加热器控制的方法

    公开(公告)号:US20140116525A1

    公开(公告)日:2014-05-01

    申请号:US13799737

    申请日:2013-03-13

    Abstract: An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.

    Abstract translation: 粘合剂分配系统被配置为自动降低粘合剂材料的温度,以减少由于在低生产量期间将粘合剂保持在施加温度下导致的粘合剂降解。 为此,系统的控制器操作加热器单元以将单元设定点温度保持在热和熔融粘合剂中,直到从填充系统最近向系统供应粘合剂而经过设定的阈值时间。 一旦从最近的粘合剂供应超过设定的阈值时间过去的时间,加热器单元的温度降低以降低粘合剂的温度。 这种降低是足够大的温度以使降解和脱气最小化,但足够小以便在新的粘合剂出现之后能够实现快速的预热时间。

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