Abstract:
A hot melt adhesive system includes an adhesive supply for receiving solid or semi-solid hot melt adhesive, and a heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive into liquid hot melt adhesive. An adhesive tracking system monitors an output of the liquid hot melt adhesive, and includes a flow meter having a flow inlet and a flow outlet. The flow meter measures an amount of the adhesive flowing out of the flow outlet. A product detector may be used to sense a presence of a product to which the adhesive is applied. A controller then determines the total amount of the liquid adhesive dispensed and the average amount of liquid adhesive dispensed per product.
Abstract:
An apparatus for supplying chemical liquid may include a chemical liquid supply member for supplying a chemical liquid onto a substrate, a chemical liquid storing member for storing the chemical liquid, a chemical liquid receiving assembly for receiving the chemical liquid provided from the chemical liquid storing member and for providing the chemical liquid into the chemical liquid supply member, a first chemical liquid supply line for supplying the chemical liquid from the chemical liquid storing member to the chemical liquid receiving assembly, and a second chemical liquid supply line for supplying the chemical liquid from the chemical liquid receiving assembly to the chemical liquid supply member.
Abstract:
A conveying device for conveying a viscous material from a container includes a follower plate that can be inserted into the container, and a pump by means of which the viscous material can be conveyed through the follower plate. Moreover, a measuring chamber for accommodation of a measuring sample of the viscous material is provided. The measuring chamber includes a closable material inlet opening for this purpose. A closable disposal line leads away from the measuring chamber. Moreover, a closable material return line extends from the measuring chamber via the follower plate into the container. The conveying device also includes a controller that is designed and can be operated appropriately such that it determines the compressibility of each of multiple measuring samples. The controller opens the disposal line or the material return line to the measuring sample present in the measuring chamber as a function of the compressibility thus determined.
Abstract:
An embodiment of the present disclosure is an applicator for dispensing adhesive onto a substrate. The applicator includes a manifold and at least one dispensing module coupled to the manifold. The applicator may include a least one pump assembly removably mounted the manifold. Each pump assembly having an outlet in flow communication with the manifold, and an inlet in flow communication with the adhesive. The pump assembly includes a gear assembly for pumping adhesive from said inlet to said outlet and a drive motor with a drive shaft connected to the gear assembly. The drive motor has a shaft with an axis that intersects said front surface of the pump assembly. In another example, the shaft has an axis that does not intersect both of a first side and a second side of said manifold.
Abstract:
Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A meniscus sensor monitors a position of a meniscus of process fluid at a nozzle. The elongate bladder unit is used to maintain a position of the meniscus at a particular location by selectively expanding or contracting the bladder, thereby moving or holding a meniscus position. Expansion of the elongate bladder is also used for a suck-back action after completing a dispense action.
Abstract:
Provided is a slurry dispensing apparatus for electromagnetic interference (EMI) shielding, and more particularly, a slurry dispensing apparatus for EMI shielding, wherein the slurry dispensing apparatus dispenses a slurry, in which a conductive metal powder and an adhesive are mixed, to an electronic component to form an electromagnetic wave shielding layer on the electronic component.By using the slurry dispensing apparatus for EMI shielding, the slurry may be dispensed while preventing separation of the metal powder included in the slurry from the adhesive by precipitation, and maintaining a uniform mixture ratio in the slurry.
Abstract:
A hot melt adhesive system includes an adhesive supply for receiving solid or semi-solid hot melt adhesive, and a heater associated with the adhesive supply for melting the solid or semi-solid hot melt adhesive into liquid hot melt adhesive. An adhesive tracking system monitors an output of the liquid hot melt adhesive, and includes a flow meter having a flow inlet and a flow outlet. The flow meter measures an amount of the adhesive flowing out of the flow outlet. A product detector may be used to sense a presence of a product to which the adhesive is applied. A controller then determines the total amount of the liquid adhesive dispensed and the average amount of liquid adhesive dispensed per product.
Abstract:
The present invention is notably directed to a microfluidic surface processing device including a microfluidic probe head with at least one aperture, on a face, including at least an outlet aperture; and a surface processing structure extending outward and perpendicular with respect to the face, the processing structure being further dimensioned and located with respect to the outlet aperture such that it can intercept a flowpath of liquid dispensed via the outlet aperture. The present invention is further directed to related apparatuses and methods.
Abstract:
An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.
Abstract:
An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.