Atomic layer etching by electron wavefront

    公开(公告)号:US12119205B2

    公开(公告)日:2024-10-15

    申请号:US18435576

    申请日:2024-02-07

    Applicant: VELVETCH LLC

    Abstract: Atomic layer etching of a substrate using a wafer scale wave of precisely controlled electrons is presented. A volume of gaseous plasma including diluent and reactive species and electrons of a uniform steady state composition is generated in a positive column of a DC plasma proximate the substrate. A corrosion layer is formed on the substrate by adsorption of the reactive species to atoms at the surface of the substrate. The substrate is positively biased to draw electrons from the volume to the surface of the substrate and impart an energy to the electrons so to stimulate electron transitions in the corrosion layer species, resulting in ejection of the corrosion layer species via electron stimulation desorption. The substrate is negatively biased to repel the electrons from the surface of the substrate back to the volume, followed by a zero bias to restore the steady state composition of the volume.

    Atomic layer etching by electron wavefront

    公开(公告)号:US11869747B1

    公开(公告)日:2024-01-09

    申请号:US18149893

    申请日:2023-01-04

    Applicant: VELVETCH LLC

    Abstract: Atomic layer etching of a substrate using a wafer scale wave of precisely controlled electrons is presented. A volume of gaseous plasma including diluent and reactive species and electrons of a uniform steady state composition is generated in a positive column of a DC plasma proximate the substrate. A corrosion layer is formed on the substrate by adsorption of the reactive species to atoms at the surface of the substrate. The substrate is positively biased to draw electrons from the volume to the surface of the substrate and impart an energy to the electrons so to stimulate electron transitions in the corrosion layer species, resulting in ejection of the corrosion layer species via electron stimulation desorption (ESD). The substrate is negatively biased to repel the electrons from the surface of the substrate back to the volume, followed by a zero bias to restore the steady state composition of the volume.

    POWER SUPPLY DEVICE FOR PLASMA PROCESSING

    公开(公告)号:US20160064923A1

    公开(公告)日:2016-03-03

    申请号:US14935910

    申请日:2015-11-09

    CPC classification number: H02H3/38 H01J37/32045 H01J37/3444 H02H1/06

    Abstract: A power supply device for plasma processing, wherein electric arcs may occur, comprises a power supply circuit for generating a voltage across output terminals, and a first switch connected between the power supply circuit and one of the output terminals. According to a first aspect the power supply device comprises a recovery energy circuit connected to the output terminals and to the power supply circuit. According to a second aspect the power supply device comprises an inductance circuit including an inductor and a second switch connected parallel to the inductor. According to a third aspect the power supply device comprises a controller for causing the power supply circuit and the first switch to be switched on and off. The controller is configured to determine a quenching time interval by means of a self-adaptive process. The quenching time interval defines the time interval during which, in an event of an arc, no voltage is generated across the output terminals.

    POWER SUPPLY DEVICE FOR PLASMA PROCESSING

    公开(公告)号:US20130271885A1

    公开(公告)日:2013-10-17

    申请号:US13846430

    申请日:2013-03-18

    CPC classification number: H02H3/38 H01J37/32045 H01J37/3444 H02H1/06

    Abstract: A power supply device for plasma processing, wherein electric arcs may occur, comprises a power supply circuit for generating a voltage across output terminals, and a first switch connected between the power supply circuit and one of the output terminals. According to a first aspect the power supply device comprises a recovery energy circuit connected to the output terminals and to the power supply circuit. According to a second aspect the power supply device comprises an inductance circuit including an inductor and a second switch connected parallel to the inductor. According to a third aspect the power supply device comprises a controller for causing the power supply circuit and the first switch to be switched on and off. The controller is configured to determine a quenching time interval by means of a self-adaptive process. The quenching time interval defines the time interval during which, in an event of an arc, no voltage is generated across the output terminals.

    Power supply device for plasma processing

    公开(公告)号:US08542471B2

    公开(公告)日:2013-09-24

    申请号:US12701813

    申请日:2010-02-08

    CPC classification number: H02H3/38 H01J37/32045 H01J37/3444 H02H1/06

    Abstract: A power supply device for plasma processing, wherein electric arcs may occur, comprises a power supply circuit for generating a voltage across output terminals, and a first switch connected between the power supply circuit and one of the output terminals. According to a first aspect the power supply device comprises a recovery energy circuit connected to the output terminals and to the power supply circuit. According to a second aspect the power supply device comprises an inductance circuit including an inductor and a second switch connected parallel to the inductor. According to a third aspect the power supply device comprises a controller for causing the power supply circuit and the first switch to be switched on and off. The controller is configured to determine a quenching time interval by means of a self-adaptive process. The quenching time interval defines the time interval during which, in an event of an arc, no voltage is generated across the output terminals.

    POWER SUPPLY DEVICE FOR PLASMA PROCESSING
    8.
    发明申请
    POWER SUPPLY DEVICE FOR PLASMA PROCESSING 有权
    用于等离子体处理的电源装置

    公开(公告)号:US20130221850A1

    公开(公告)日:2013-08-29

    申请号:US13846505

    申请日:2013-03-18

    CPC classification number: H02H3/38 H01J37/32045 H01J37/3444 H02H1/06

    Abstract: A power supply device for plasma processing, wherein electric arcs may occur, comprises a power supply circuit for generating a voltage across output terminals, and a first switch connected between the power supply circuit and one of the output terminals. According to a first aspect the power supply device comprises a recovery energy circuit connected to the output terminals and to the power supply circuit. According to a second aspect the power supply device comprises an inductance circuit including an inductor and a second switch connected parallel to the inductor. According to a third aspect the power supply device comprises a controller for causing the power supply circuit and the first switch to be switched on and off. The controller is configured to determine a quenching time interval by means of a self-adaptive process. The quenching time interval defines the time interval during which, in an event of an arc, no voltage is generated across the output terminals.

    Abstract translation: 一种用于等离子体处理的电源装置,其中可能发生电弧,包括用于在输出端子之间产生电压的电源电路和连接在电源电路和其中一个输出端子之间的第一开关。 根据第一方面,电源装置包括连接到输出端子和电源电路的恢复能量电路。 根据第二方面,电源装置包括电感电路,其包括电感器和与电感器并联连接的第二开关。 根据第三方面,电源装置包括用于使电源电路和第一开关被接通和断开的控制器。 控制器被配置为通过自适应过程来确定淬灭时间间隔。 淬火时间间隔定义了在电弧的情况下在输出端子之间不产生电压的时间间隔。

    OVER-VOLTAGE PROTECTION DURING ARC RECOVERY FOR PLASMA-CHAMBER POWER SUPPLIES
    9.
    发明申请
    OVER-VOLTAGE PROTECTION DURING ARC RECOVERY FOR PLASMA-CHAMBER POWER SUPPLIES 有权
    用于等离子体电源的电弧恢复期间的过电压保护

    公开(公告)号:US20130180964A1

    公开(公告)日:2013-07-18

    申请号:US13785888

    申请日:2013-03-05

    Inventor: Milan Ilic

    CPC classification number: B23K10/006 H01J37/32045 H05H1/46

    Abstract: A system and method for managing power delivered to a processing chamber is described. In one embodiment current is drawn away from the plasma processing chamber while initiating an application of power to the plasma processing chamber during an initial period of time, the amount of current being drawn away decreasing during the initial period of time so as to increase the amount of power applied to the plasma processing chamber during the initial period of time.

    Abstract translation: 描述了用于管理传送到处理室的功率的系统和方法。 在一个实施例中,电流从等离子体处理室被拉出,同时在初始时间段期间开始向等离子体处理室施加电力,在初始时间段内电流的量被减少,从而增加量 在初始时间期间施加到等离子体处理室的功率。

    Driving switches of a plasma load power supply
    10.
    发明授权
    Driving switches of a plasma load power supply 有权
    驱动等离子体负载电源的开关

    公开(公告)号:US08482205B2

    公开(公告)日:2013-07-09

    申请号:US12687483

    申请日:2010-01-14

    Abstract: Operation of a plasma supply device having at least one switching bridge with at least two switching elements, and configured to deliver a high frequency output signal having a power of >500 W and a substantially constant fundamental frequency >3 MHz to a plasma load is accomplished by determining at least one operating parameter, at least one environmental parameter of at least one switching element and/or a switching bridge parameter, determining individual drive signals for the switching elements taking into account the at least one operating parameter, the at least one environmental parameter and/or the switching bridge parameter, and individually driving the switching elements with a respective drive signal.

    Abstract translation: 具有至少一个具有至少两个开关元件的开关桥的等离子体供给装置的操作被实现为等离子体负载,将具有> 500W的功率和基本上恒定的基频> 3MHz的高频输出信号传送到等离子体负载 通过确定至少一个操作参数,至少一个开关元件和/或开关桥接参数的至少一个环境参数,确定考虑到所述至少一个操作参数的开关元件的各个驱动信号,所述至少一个环境 参数和/或开关桥接参数,并用相应的驱动信号分别驱动开关元件。

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