A substrate heat treatment apparatus that can suppress generation of the surface roughening of a substrate to which heat treatment is performed. The apparatus is provided with a heater for performing heat treatment to a substrate arranged in a treatment chamber, and the apparatus performs heat treatment to the substrate. A susceptor is arranged between the heater and the substrate, and susceptor surface on a side whereupon the substrate is arranged is covered with a member which does not degas while the substrate heat treatment is performed. A heat receiving body for receiving heat from the heater through the susceptor is arranged on a side which faces the susceptor by having the substrate in between, and a surface of the heat receiving body on the side whereupon the substrate is arrangedis covered with a member which does not degas while the substrate heat treatment is performed.To provide a substrate heat treatment apparatus which can suppress generation of a rough surface of a substrate to which heat treatment is performed. [MEANS FOR SOLVING PROBLEMS] The substrate heat treatment apparatus is provided with a heating means for performing heat treatment to a substrate arranged in a treatment chamber which can be evacuated, and the apparatus performs heat treatment to the substrate arranged in the treatment chamber by the heating means. A susceptor is arranged between the heating means and the substrate, and a susceptor surface on a side whereupon the substrate is arranged is covered with a member which does not discharge a gas while the substrate heat treatment is performed. A heat receiving body for receiving heat from the heating means through the susceptor is arranged on a side which faces the susceptor by having the substrate in between, and a surface of the heat receiving body on the side whereupon the substrate is arranged is covered with a member which does not discharge a gas while the substrate heat treatment is performed.