In a laser welding method, a gap between first and second members to be welded is made at most 300 [mu]m by pressing the second member against the first member with claws that are pressing parts of a laser welding jig, and the second member to be welded at a place between the claws is irradiated by laser light to laser-weld the first member and the second member. In a semiconductor device, the gap between the first member and the second member at the portion of laser-welding is at most 300 [mu]m.