The invention provides a method of fabricating a light emitting device. The method includes placing a substrate in a first room, the substrate comprising a first semiconductor layer and a metal material layer formed on the first semiconductor layer in preset patterns; in the first room, forming a second semiconductor layer on the first semiconductor layer and the metal material layer, wherein a void is formed on the first semiconductor layer under the metal material layer, and transmitting the substrate with the second semiconductor layer from the first room to the second room; and in the second room, forming a compound semiconductor layer on the second semiconductor layer.