The invention provides a magnetron element and a magnetron sputtering device. The magnetron element comprises a closed magnetic pole and an open magnetic pole, the closed magnetic pole surrounds the open magnetic pole, and the magnetic field formed between the closed magnetic pole and the open magnetic pole enables the uniformity of a sputter deposited thin film to be less than 5%. The magnetron element provided with a closed magnetic pole and an open magnetic pole can be applied to an RF/DC PVD technology. By adjusting the shape and distribution of the plasma path formed between the closed magnetic pole and the open magnetic pole, the sputter deposited thin film can meet the requirement for set uniformity under the full process pressure range, so that the uniformity of the deposited thinfilm is greatly improved; a magnetron sputtering system using the magnetron element and the applicable thin film deposition material are more extensive, and the magnetron element can also improve theutilization rate of a target.