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Invention Publication
CN107871728A 集成电路封装、其制造方法和包括所述封装的可穿戴设备 失效 - 权利终止

集成电路封装、其制造方法和包括所述封装的可穿戴设备
Abstract:
一种集成电路封装包括：至少一个第一芯片，安装在印刷电路板的安装表面的第一区中；模制单元，覆盖实施安装表面并包围所述至少一个第一芯片；电磁屏蔽膜，覆盖所述模制单元的表面并包围所述至少一个第一芯片；以及第二芯片，安装在所述安装表面的第二区中。第二芯片暴露在所述电磁屏蔽膜外部并与所述印刷电路板间隔开，其中所述模制单元位于第二芯片和所述印刷电路板之间。
Abstract(English):

An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surroundingthe at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.

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