The invention discloses a multi-chip stacked fan-out packaging structure comprising a first chip; a second chip; one or more copper cylinders; a plastic package layer covering the first chip, the second chip and the copper cylinders; a first metal layer electrically connected to the first chip and/or the first end(s) of the one or more copper cylinders; a first passivation layer covering the surface and the gap of the first metal layer; a second metal layer electrically connected to the first metal layer; a third metal layer electrically connected to the second chip and/or the second end(s) ofthe one or more copper cylinders; a second passivation layer covering the surface and the gap of the third metal layer; a fourth metal layer electricity connected to the third metal layer; a third passivation layer covering the surface and the gap of the fourth metal layer; a fifth metal layer electrically connected to the fourth metal layer; and a fourth passivation layer covering the surface and the gap of the fifth metal layer; and an external solder ball electrically connected to the fifth metal layer.