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Invention Publication
CN110400779A 封装结构 有权

封装结构
Abstract:
本申请提供一种封装结构。该封装结构包括：第一辐射板、第二辐射板和馈电部，第二辐射板设置在第一辐射板的下方，第二辐射板上设置有缝隙，缝隙为环形形状，馈电部设置在第二辐射板的下方，馈电部包括相互独立设置的第一馈电枝节和第二馈电枝节，第一馈电枝节与第二馈电枝节相互垂直设置在缝隙下方的基板上，第一馈电枝节和第二馈电枝节通过缝隙对第一辐射板进行馈电。从而，可实现宽带宽和高增益的封装结构。
Abstract(English):

The invention provides a packaging structure, which comprises a first radiant panel, a second radiant panel and a feed portion, wherein the second radiant panel is disposed below the first radiant panel; the second radiant panel is provided thereon with an annular slit; the feed portion is disposed below the second radiant panel and comprises a first feed branch and a second feed branch which arearranged independently from each other; and the first feed branch and the second feed branch are disposed perpendicularly to each other on a substrate below the slit and feed the first radiant panel by means of the slit. Thus, the packaging structure having a wide bandwidth and high gains can be achieved.

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