Combination of structure and an active damping system, and a lithographic apparatus.

Invention Patent

NL1036161A1 Combination of structure and an active damping system, and a lithographic apparatus. 未知

Patent Title: Combination of structure and an active damping system, and a lithographic apparatus.
Application No.: NL1036161

Application Date: 2008-11-06
Publication No.: NL1036161A1

Publication Date: 2009-05-25
Inventor: BUTLER HANS , WIJST MARC WILHELMUS MARIA VAN , PEE JOOST DE , HOON CORNELIUS ADRIANUS LAMBERTUS , BOSCHKER STIJN
Applicant: ASML NETHERLANDS BV
Assignee: ASML NETHERLANDS BV
Current Assignee: ASML NETHERLANDS BV
Priority: US99650307 2007-11-20
Main IPC: H01L21/68
IPC: H01L21/68 ; G03F9/00

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/67	.专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置
H01L21/68	..用于定位、定向或对准的