- Patent Title: Aluminium-silicon carbide composite, and power-module base plate
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Application No.: US15127214Application Date: 2015-03-18
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Publication No.: US10233125B2Publication Date: 2019-03-19
- Inventor: Daisuke Goto , Hideki Hirotsuru , Yoshitaka Taniguchi , Goh Iwamoto , Kazunori Koyanagi
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-054706 20140318
- International Application: PCT/JP2015/058068 WO 20150318
- International Announcement: WO2015/141729 WO 20150924
- Main IPC: C04B35/80
- IPC: C04B35/80 ; C04B41/88 ; C04B41/00 ; C04B41/51 ; H01L23/373 ; H01L21/48 ; C04B111/00

Abstract:
To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.
Public/Granted literature
- US20170107158A1 ALUMINIUM-SILICON CARBIDE COMPOSITE, AND POWER-MODULE BASE PLATE Public/Granted day:2017-04-20
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