公开(公告)号：US20190092695A1

公开(公告)日：2019-03-28

申请号：US16083035

申请日：2017-03-10

Applicant: DENKA COMPANY LIMITED

Inventor： Taiki Nishi ,  Hideki Hirotsuru ,  Toshikatsu Mitsunaga ,  Saori Inoue

IPC: C04B35/584 ,  C04B35/581 ,  C04B35/583 ,  C04B35/634 ,  H05K1/03

Abstract: Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 μm and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180° C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.

公开(公告)号：US10087112B2

公开(公告)日：2018-10-02

申请号：US14895469

申请日：2014-06-02

Applicant: Denka Company Limited

Inventor： Koki Ikarashi ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Hideki Hirotsuru ,  Mitsuru Shiiba

IPC: C04B35/583 ,  C04B41/00 ,  C04B41/49 ,  C04B41/48 ,  C04B41/84 ,  C04B41/83 ,  H01L23/14 ,  H01L23/373 ,  H05K1/03 ,  C04B111/00

Abstract: A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.

公开(公告)号：US09516741B2

公开(公告)日：2016-12-06

申请号：US14911707

申请日：2014-08-12

Applicant: Denka Company Limited

Inventor： Hideki Hirotsuru ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Koki Ikarashi ,  Kouji Miyata ,  Taiki Nishi ,  Saori Inoue ,  Fumiya Kobayashi

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  C08K7/00 ,  H05K3/02 ,  H05K3/38 ,  C08K3/38

CPC classification number: H05K1/0271 ,  C08K7/00 ,  C08K2003/385 ,  C08K2201/004 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K3/38 ,  H05K2201/0104 ,  H05K2201/066

Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high reliability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.

Abstract translation: 提供具有高散热特性和高可靠性的氮化硼/树脂复合电路板。 一种氮化硼/树脂复合电路板，包括：板厚为0.2〜1.5mm的板状树脂浸渍氮化硼烧结体，含有30〜85体积％的板状树脂浸渍氮化硼烧结体 具有三维结合的氮化硼颗粒的氮化硼烧结体，平均长径为5〜50μm的氮化硼颗粒和70〜15体积％的树脂; 以及附着在板状树脂浸渍氮化硼烧结体的两个主平面上的金属电路，金属电路为铜或铝，其中：树脂浸渍硼的平面方向的线性热膨胀系数的比例 40℃〜150℃（CTE1）的金属电路的线性热膨胀系数（CTE2）（CTE1 / CTE2）为40〜150℃。

公开(公告)号：US20160130187A1

公开(公告)日：2016-05-12

申请号：US14895469

申请日：2014-06-02

Applicant: DENKA COMPANY LIMITED

Inventor： Koki Ikarashi ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Hideki Hirotsuru ,  Mitsuru Shiiba

IPC: C04B35/583 ,  C04B41/00 ,  C04B41/49 ,  C04B41/48

CPC classification number: C04B41/84 ,  C04B35/583 ,  C04B41/009 ,  C04B41/48 ,  C04B41/4853 ,  C04B41/4905 ,  C04B41/4961 ,  C04B41/83 ,  C04B2111/00844 ,  C04B2235/3208 ,  C04B2235/386 ,  C04B2235/3895 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/5472 ,  C04B2235/787 ,  C04B2235/9607 ,  H01L23/145 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0209 ,  H01L2924/00 ,  C04B38/00

Abstract: A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.

Abstract translation: 提供具有优良导热性和优异强度的树脂浸渍氮化硼烧结体，以及具有优异导电性和小导热性各向异性的树脂浸渍氮化硼烧结体。 一种树脂浸渍氮化硼烧结体，其包括：三维结合氮化硼颗粒的氮化硼烧结体的30〜90体积％ 和10〜70体积％的树脂; 其中，所述氮化硼烧结体的孔隙率为10〜70％。 氮化硼烧结体的氮化硼粒子的平均长径为10μm以上， 氮化硼烧结体的粉末X射线衍射法的石墨化指数为4.0以下; 氮化硼烧结体的氮化硼粒子的取向度为0.01〜0.05或20〜100; 和树脂浸渍的氮化硼烧结体，其包括：三维结合氮化硼颗粒的氮化硼烧结体的30〜90体积％。

公开(公告)号：US10081055B2

公开(公告)日：2018-09-25

申请号：US15328723

申请日：2015-07-24

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi Miyakawa ,  Hideki Hirotsuru

IPC: B22D19/14 ,  B22D21/00 ,  B32B5/24 ,  B22D18/02 ,  B32B5/30 ,  C04B37/00 ,  C22C21/02 ,  C04B41/90 ,  C04B41/00 ,  C04B41/52 ,  C04B111/00

Abstract: A composite production method includes impregnating a plate-shaped porous inorganic structure and a fibrous inorganic material with a metal while the fibrous inorganic material is arranged to be adjacent to the porous inorganic structure. In the composite structure, first and second phases are adjacent to each other by using a porous inorganic structure having a porous silicon carbide ceramic sintered body and the fibrous inorganic material, the first phase being a phase in which the porous silicon carbide ceramic sintered body is impregnated with the metal, the second phase being a phase in which the fibrous inorganic material is impregnated with the metal, a percentage of the porous silicon carbide ceramic sintered body in the first phase is 50 to 80 volume percent, and a percentage of the fibrous inorganic material in the second phase is 3 to 20 volume percent. A composite is produced by the method.

公开(公告)号：US11296008B2

公开(公告)日：2022-04-05

申请号：US15500210

申请日：2015-07-29

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi Miyakawa ,  Motonori Kino ,  Hideki Hirotsuru

IPC: H01L23/373 ,  B22D19/00 ,  C22C21/04 ,  B22D19/04 ,  H01L23/36 ,  B21J1/00 ,  B21J5/00 ,  B22D17/00 ,  B22D18/02 ,  B22D21/00 ,  B32B3/26 ,  B32B9/00 ,  B32B9/04 ,  B32B15/20 ,  H01L23/367 ,  H05K1/02 ,  H05K3/00

Abstract: An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91≤Ax/B≤1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94≤Ay/B≤1.00 and production method therefor.

公开(公告)号：US11096278B2

公开(公告)日：2021-08-17

申请号：US16636239

申请日：2018-07-30

Applicant: DENKA COMPANY LIMITED

Inventor： Atsushi Sakai ,  Hideki Hirotsuru ,  Kohki Ichikawa ,  Yoshitaka Taniguchi

IPC: H05K1/03 ,  H05K1/05

Abstract: A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value α1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10−6 to 9×10−6/K, a ratio α1/α2 of the α1 to a theoretical value α2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.

公开(公告)号：US10233125B2

公开(公告)日：2019-03-19

申请号：US15127214

申请日：2015-03-18

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke Goto ,  Hideki Hirotsuru ,  Yoshitaka Taniguchi ,  Goh Iwamoto ,  Kazunori Koyanagi

IPC: C04B35/80 ,  C04B41/88 ,  C04B41/00 ,  C04B41/51 ,  H01L23/373 ,  H01L21/48 ,  C04B111/00

Abstract: To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.

公开(公告)号：US11094648B2

公开(公告)日：2021-08-17

申请号：US16636184

申请日：2018-07-30

Applicant: DENKA COMPANY LIMITED

Inventor： Hideki Hirotsuru ,  Yoshitaka Taniguchi ,  Kohki Ichikawa ,  Atsushi Sakai

IPC: H01L23/00 ,  H01L23/15 ,  H01L25/07

Abstract: A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient α1 (×10−6/K) of the base plate and a linear thermal expansion coefficient α2 (×10−6/K) of the ceramic insulating substrate when a temperature decreases in the range of 25° C. to 150° C. satisfy the following Expression (1).  α ⁢ ⁢ 1 - α ⁢ ⁢ 2  ( α ⁢ ⁢ 1 + α ⁢ ⁢ 2 ) ⁢ / ⁢ 2 × 100 ≤ 10 ( 1 )

公开(公告)号：US10377676B2

公开(公告)日：2019-08-13

申请号：US15297722

申请日：2016-10-19

Applicant: Denka Company Limited

Inventor： Koki Ikarashi ,  Shuhei Nonaka ,  Toshikatsu Mitsunaga ,  Hideki Hirotsuru ,  Mitsuru Shiiba

IPC: C04B35/583 ,  C04B41/00 ,  C04B41/84 ,  C04B41/83 ,  C04B41/48 ,  C04B41/49 ,  H01L23/14 ,  H01L23/373 ,  H05K1/03 ,  C04B111/00

Abstract: A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 μm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.