A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, a combining layer firmly fixing the translucent layer to the sensor chip, and a packaging compound. A top surface of the sensor chip has a sensing region and a spacing region around the sensing region. The sensor chip includes several connecting pads arranged on the top surface between at least part of the edges thereof and the spacing region. The translucent layer has a fixing region arranged outside a portion thereof adhered to the combining layer. The packaging compound covers the fixing region and the external sides of the sensor chip, the combining layer, and the translucent layer. Each metal wire is embedded in the combining layer and the packaging compound.