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    Sensor package structure
    2.
    发明授权
    Sensor package structure 有权

    公开(公告)号：US10236313B2

    公开(公告)日：2019-03-19

    申请号：US15641401

    申请日：2017-07-05

    Applicant: KINGPAK TECHNOLOGY INC.

    Inventor： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Jian-Ru Chen

    IPC: H01L27/146

    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, a combining layer firmly fixing the translucent layer to the sensor chip, and a packaging compound. A top surface of the sensor chip has a sensing region and a spacing region around the sensing region. The sensor chip includes several connecting pads arranged on the top surface between at least part of the edges thereof and the spacing region. The translucent layer has a fixing region arranged outside a portion thereof adhered to the combining layer. The packaging compound covers the fixing region and the external sides of the sensor chip, the combining layer, and the translucent layer. Each metal wire is embedded in the combining layer and the packaging compound.

    Optical sensor
    3.
    发明授权
    Optical sensor 有权

    公开(公告)号：US10700111B2

    公开(公告)日：2020-06-30

    申请号：US16294436

    申请日：2019-03-06

    Applicant: KINGPAK TECHNOLOGY INC.

    Inventor： Li-Chun Hung ,  Chien-Chen Lee ,  Hsiu-Wen Tu

    IPC: H01L27/146 ,  H01L23/31 ,  H01L23/528 ,  H01L23/498 ,  H01L23/00

    Abstract: Disclosed is an optical sensor including a substrate, a redistribution chip structure disposed on the substrate, a sensor chip disposed on the redistribution chip structure, a light-permeable sheet arranged above the sensor chip, metal wires electrically connecting the substrate and the sensor chip, and a package body disposed on the substrate. The redistribution chip structure includes an insulating body, a first electronic chip embedded in the insulating body, and a redistribution layer (RDL) connected to bottoms of the insulating body and the first electronic chip. The RDL is fixed onto the substrate in a flip-chip manner. A projected region defined by orthogonally projecting a sensing area of the sensor chip onto the redistribution chip structure is located inside outer edges of the redistribution chip structure. The redistribution chip structure, the sensor chip, a part of the light-permeable sheet, and the metal wires are embedded in the package body.

    Sensor package structure
    4.
    发明授权
    Sensor package structure 有权

    公开(公告)号：US10692917B2

    公开(公告)日：2020-06-23

    申请号：US16133874

    申请日：2018-09-18

    Applicant: KINGPAK TECHNOLOGY INC.

    Inventor： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Jian-Ru Chen

    IPC: H01L31/0203 ,  H01L27/146 ,  H01L23/00 ,  H01L23/498

    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the sensor chip to the substrate, a light-permeable layer, a combining layer connecting a portion of the light-permeable layer onto the sensor chip, and a packaging compound covering lateral sides of the sensor chip, the light-permeable layer, and the combining layer. Each of the metal wires is embedded in the combining layer and the packaging compound, and has a diameter within a range of 0.8-1.1 mil. Each of the metal wires includes a first segment connected to the substrate and a second segment connected to the sensor chip. In each of the metal wires, the second segment integrally and curvedly extends from the first segment, and the second segment and a top surface of the sensor chip have a sloping angle within a range of 5-45 degrees.

    Sensor package structure
    5.
    发明授权
    Sensor package structure 有权

    公开(公告)号：US10186538B2

    公开(公告)日：2019-01-22

    申请号：US15641378

    申请日：2017-07-05

    Applicant: KINGPAK TECHNOLOGY INC.

    Inventor： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Jian-Ru Chen

    IPC: H01L27/146

    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, and an adhesive. A top surface of the sensor chip has a sensing region and a spacing region around the sensing region. The sensor chip includes several connecting pads arranged on a first portion of the top surface between the first edge and the spacing region, and a second portion of the top surface between the second edge and the spacing region is provided without any connecting pad. The width of the first portion is greater than that of the second portion. The adhesive covers the surrounding side of the sensor chip, the first portion, and the surrounding side of the translucent layer. Part of each metal wire is embedded in the adhesive.

    Two-stage packaging method of image sensors
    6.
    发明授权
    Two-stage packaging method of image sensors 有权
    图像传感器的两阶段封装方法

    公开(公告)号：US08969120B2

    公开(公告)日：2015-03-03

    申请号：US14053743

    申请日：2013-10-15

    Applicant: Kingpak Technology Inc.

    Inventor： Chun-Lung Huang ,  Hsiu-Wen Tu ,  Cheng-Chang Wu ,  Chung-Yu Yang ,  Rong-Chang Wang ,  Jo-Wei Yang

    IPC: H01L21/00 ,  G01R31/26 ,  H01L21/66 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L31/0203

    CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

    Abstract translation: 公开了一种图像传感器的两级封装方法。 包装方法包括以下步骤：提供基板，将图像传感器芯片固定在基板上，将透明基板固定在图像传感器芯片上，电连接图像传感器芯片和基板，形成第一密封材料，形成 第二密封剂层。 两级包装方法防止在图像传感器封装过程中通过形成密封剂层而产生过大的压力。 如果产生这种过大的压力，则可能导致图像传感器芯片的位置偏移或接合线的损坏。 两级包装方法可以提高图像传感器封装过程的产量以及图像传感器的灵敏度，从而提高图像传感器封装的质量和生产，同时降低制造成本。

    Sensor package structure
    7.
    发明授权
    Sensor package structure 有权

    公开(公告)号：US10825851B2

    公开(公告)日：2020-11-03

    申请号：US16390280

    申请日：2019-04-22

    Applicant: KINGPAK TECHNOLOGY INC.

    Inventor： Sheng Yang ,  Li-Chun Hung ,  Hsiu-Wen Tu ,  Jo-Wei Yang ,  Chien-Chen Lee ,  Jian-Ru Chen

    IPC: H01L23/498 ,  H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  H01L23/04

    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensor chip, a glass cover disposed on the sensor chip, and an adhesive layer connecting the glass cover to the substrate. The substrate is made of a material having a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C. The glass cover includes a board body and an annular supporting body connected to the board body. The annular supporting body of the glass cover is fixed onto the substrate through the adhesive layer, so that the glass cover and the substrate jointly surround an enclosed accommodating space. The sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body.

    Sensor package structure
    8.
    发明授权
    Sensor package structure 有权

    公开(公告)号：US10600830B2

    公开(公告)日：2020-03-24

    申请号：US15819741

    申请日：2017-11-21

    Applicant: KINGPAK TECHNOLOGY INC.

    Inventor： Jian-Ru Chen ,  Jo-Wei Yang ,  Li-Chun Hung ,  Hsiu-Wen Tu ,  Chung-Hsien Hsin

    IPC: H01L27/146 ,  H01L23/00 ,  H01L23/31

    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically connected to the substrate and the sensor chip, a transparent layer facing the sensor chip, a support disposed on the substrate, and a packaging compound disposed on the substrate and covering side edges of the support and the transparent layer. A part of each wire is embedded in the support. A height from the upper surface of the substrate to the top of the support is larger than a height from the upper surface of the substrate to the top of any of the wires. The bottom surface of the transparent layer has a central region facing the sensor chip and a ring-shaped supporting region surrounded by the central region. The support is arranged outside the sensor chip and abuts against the supporting region.

    Chip-scale sensor package structure
    10.
    发明授权
    Chip-scale sensor package structure 有权

    公开(公告)号：US10964615B2

    公开(公告)日：2021-03-30

    申请号：US16454143

    申请日：2019-06-27

    Applicant: KINGPAK TECHNOLOGY INC.

    Inventor： Li-Chun Hung ,  Chien-Chen Lee ,  Hsiu-Wen Tu

    IPC: H01L23/31 ,  H01L31/02 ,  H01L31/0203

    Abstract: A chip-scale sensor package structure includes a sensor chip, a ring-shaped support disposed on a top surface of the sensor chip, a light permeable member disposed on the ring-shaped support, a package body, and a redistribution layer (RDL). The package body surrounds outer lateral sides of the sensor chip, the ring-shaped support and the light permeable member. A bottom surface of the sensor chip and a surface of the light permeable member are exposed from the package body. The RDL is directly formed on the bottom surface of the sensor chip and a bottom side of the package body. The RDL includes a plurality of external contacts arranged on a bottom surface thereof and electrically coupled to the sensor chip. A portion of the external contacts are arranged outside of a projection region defined by orthogonally projecting the sensor chip onto the bottom surface of the RDL.

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