Invention Grant
- Patent Title: Ion milling device and ion milling method
-
Application No.: US15500392Application Date: 2015-07-29
-
Publication No.: US10332722B2Publication Date: 2019-06-25
- Inventor: Kengo Asai , Hiroyasu Shichi , Hisayuki Takasu , Toru Iwaya
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2014-154423 20140730
- International Application: PCT/JP2015/071432 WO 20150729
- International Announcement: WO2016/017660 WO 20160204
- Main IPC: H01J37/302
- IPC: H01J37/302 ; H01J37/24 ; H01J37/08 ; H01J37/305 ; H01J37/304 ; H01J27/04

Abstract:
To provide an ion gun of a penning discharge type capable of narrowing a beam with a low ion beam current at a low acceleration voltage, an ion milling device including the same, and an ion milling method.An ion milling device that controls half width of a beam profile of an ion beam with which a sample is irradiated from an ion gun to be in a range of 200 μm to 350 μm. The device includes: the ion gun that ionizes a gas supplied from the outside, and emits an ion beam; a gas-flow-rate varying unit that varies a flow rate of the gas supplied to the ion gun; and a current measurement unit that measures a current value of the ion beam emitted from the ion gun. The gas-flow-rate varying unit sets a gas flow rate to be higher than a gas flow rate at which the ion beam current has a maximum value based on the current value measured by the current measurement unit and the flow rate of the gas determined by the gas-flow-rate varying unit.
Public/Granted literature
- US20170221677A1 ION MILLING DEVICE AND ION MILLING METHOD Public/Granted day:2017-08-03
Information query