Invention Grant
- Patent Title: Patterned substrate imaging using multiple electron beams
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Application No.: US15872570Application Date: 2018-01-16
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Publication No.: US10347460B2Publication Date: 2019-07-09
- Inventor: Yan Zhao , Weiqiang Sun , Tao Feng
- Applicant: Dongfang Jingyuan Electron Limited
- Applicant Address: CN Beijing
- Assignee: Dongfang Jingyuan Electron Limited
- Current Assignee: Dongfang Jingyuan Electron Limited
- Current Assignee Address: CN Beijing
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Main IPC: H01J37/147
- IPC: H01J37/147 ; H01J37/20 ; H01J37/22 ; H01J37/12 ; H01J37/244 ; H01J37/145 ; H01J37/28

Abstract:
A method for imaging a surface of a substrate using a multi-beam imaging system includes: modifying an electron beam using a multipole-field device; generating beamlets from the electron beam using a beam-splitting device having multiple apertures; in response to projecting foci of the beamlets onto the surface, driving the beamlets using a deflector set to scan a region of the surface for receiving signals based on electrons scattered from the region; and determining an image of the region for inspection based on the signals. The multi-beam imaging system includes: an electron source; a first multipole-field device for beam shaping and beam aberration correction; a beam-splitting device; a projection lens set; a deflector set; an objective lens set; a detector array; a second multipole-field device; a processor; and a memory storing instructions to determine an image of the region for inspection based on the signals.
Public/Granted literature
- US20180254167A1 Patterned Substrate Imaging Using Multiple Electron Beams Public/Granted day:2018-09-06
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