Invention Grant
- Patent Title: Warpage balancing in thin packages
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Application No.: US15977905Application Date: 2018-05-11
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Publication No.: US10483217B2Publication Date: 2019-11-19
- Inventor: Belgacem Haba , Sangil Lee , Craig Mitchell , Gabriel Z. Guevara , Javier A. Delacruz
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; H01L23/00 ; B23K1/00 ; H01L23/538 ; H01L23/31

Abstract:
Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.
Public/Granted literature
- US20180261556A1 Warpage Balancing In Thin Packages Public/Granted day:2018-09-13
Information query
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