Invention Grant
- Patent Title: Method, apparatus and system for wafer dechucking using dynamic voltage sweeping
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Application No.: US16153650Application Date: 2018-10-05
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Publication No.: US10546731B1Publication Date: 2020-01-28
- Inventor: Haitao Wang , Michael G. Chafin , Kartik Ramaswamy , Yue Guo , Valentin Todorow , Kenny Doan , Sergio F. Shoji , Brad L. Mays , Usama Dadu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32 ; H01L21/67 ; H01L21/66
Abstract:
A method, apparatus and system for dechucking a processing object from a surface of an electrostatic chuck (ESC) in a processing chamber can include applying to the ESC for a first time interval, a first dechuck voltage having a substantially equal magnitude and opposite polarity of a chuck voltage chucking the processing object to the surface of the ESC, selecting a second dechuck voltage having an opposite polarity as the first dechuck voltage, linearly sweeping the ESC voltage from the first dechuck voltage to the second dechuck voltage over a second time interval, monitoring the ESC current during the second time interval until a current spike in the ESC current above a threshold is detected, communicating a command to move support pins up to remove the processing object from the ESC surface, and maintaining the second dechuck voltage until the processing object is separated from the surface of the ESC.
Information query
IPC分类:
