A circuit board electrically connected to a chip includes a substrate and a circuit layer. A first conductive line of the circuit layer includes a main line and a branch lead connected with each other. The branch lead provided to increase lead quantity for bonding with the chip includes an extension part and a bonding part which is used for bonding a bump of the chip. During thermal compression, gaps existing between the extension part and the main line and between the bonding part and the main line can prevent solder on the main line from flowing toward the bump and overflowing from the branch lead.