Invention Grant
- Patent Title: Mask blank, phase shift mask, and method of manufacturing semiconductor device
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Application No.: US16975658Application Date: 2019-02-13
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Publication No.: US11022875B2Publication Date: 2021-06-01
- Inventor: Kazutake Taniguchi , Hitoshi Maeda , Ryo Ohkubo
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JPJP2018-032847 20180227
- International Application: PCT/JP2019/005030 WO 20190213
- International Announcement: WO2019/167622 WO 20190906
- Main IPC: G03F1/32
- IPC: G03F1/32 ; H01L21/033 ; H01L21/3065

Abstract:
Provided is a mask blank for a phase shift mask including an etching stopper film. A mask blank has a structure where a transparent substrate has layered thereon an etching stopper film and a phase shift film in this order, in which the phase shift film contains silicon and oxygen, in which the phase shift film has a refractive index n1 of 1.5 or more for light of 193 nm wavelength and an extinction coefficient k1 of 0.1 or less for light of 193 nm wavelength, in which the etching stopper film has a refractive index n2 of 2.6 or more for light of 193 nm wavelength and an extinction coefficient k2 of 0.4 or less for light of 193 nm wavelength, and the refractive index n2 and the extinction coefficient k2 satisfy at least one of k2≤[(−0.188×n2)+0.879] and k2≤[(2.75×n2)−6.945].
Information query