Invention Grant
- Patent Title: Silver powder and method for producing same
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Application No.: US17086552Application Date: 2020-11-02
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Publication No.: US11407030B2Publication Date: 2022-08-09
- Inventor: Atsushi Ebara , Kenichi Inoue , Yoshiyuki Michiaki , Takahiro Yamada , Masahiro Yoshida
- Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Bachman & LaPointe, P.C.
- Priority: JP2015-213682 20151030,JP2016-204799 20161019
- Main IPC: H01B1/02
- IPC: H01B1/02 ; C09D5/24 ; B22F9/08 ; C22C5/06 ; H01B1/22 ; B22F1/00 ; B22F1/05 ; C09D7/40 ; C08K3/08

Abstract:
There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%).
Public/Granted literature
- US20210078081A1 SILVER POWDER AND METHOD FOR PRODUCING SAME Public/Granted day:2021-03-18
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