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公开(公告)号：US20210078081A1
公开(公告)日：2021-03-18
申请号：US17086552
申请日：2020-11-02
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Atsushi Ebara , Kenichi Inoue , Yoshiyuki Michiaki , Takahiro Yamada , Masahiro Yoshida
Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%).
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公开(公告)号：US20180326497A1
公开(公告)日：2018-11-15
申请号：US15768065
申请日：2016-10-26
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Atsushi Ebara , Kenichi Inoue , Yoshiyuki Michiaki , Takahiro Yamada , Masahiro Yoshida
CPC classification number: B22F9/082 , B22F1/0003 , B22F1/0011 , B22F2009/0828 , B22F2301/255 , B22F2304/10 , C08K2003/0806 , C08K2201/001 , C08K2201/005 , C08K2201/006 , C09D5/24 , C09D7/69 , C22C5/06 , H01B1/02 , H01B1/22
Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%).
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公开(公告)号：US12049684B2
公开(公告)日：2024-07-30
申请号：US18196614
申请日：2023-05-12
Applicant: Dowa Electronics Materials Co., Ltd.
Inventor： Masahiro Yoshida , Kenichi Inoue , Atsushi Ebara , Yoshiyuki Michiaki , Takahiro Yamada
CPC classification number: C22C1/0425 , B22F1/05 , B22F1/10 , B22F9/082 , H01B1/22 , B22F1/09 , B22F2009/0828 , B22F2009/0832 , B22F2009/086 , B22F2201/013 , B22F2201/02 , B22F2201/04 , B22F2201/11 , B22F2203/13 , B22F2301/10 , B22F2303/01 , B22F2304/10 , B22F2998/10 , B22F2999/00 , B22F1/10 , C22C1/0425 , B22F1/05
Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
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公开(公告)号：US20230279523A1
公开(公告)日：2023-09-07
申请号：US18196614
申请日：2023-05-12
Applicant: Dowa Electronics Materials Co., Ltd.
Inventor： Masahiro Yoshida , Kenichi Inoue , Atsushi Ebara , Yoshiyuki Michiaki , Takahiro Yamada
CPC classification number: C22C1/0425 , B22F9/082 , H01B1/22 , B22F1/10 , B22F1/05 , B22F2009/0828 , B22F2009/0832 , B22F2009/086 , B22F2201/013 , B22F2201/02 , B22F2201/04 , B22F2201/11 , B22F2203/13 , B22F2301/10 , B22F2303/01 , B22F2304/10 , B22F2998/10 , B22F1/09
Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
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公开(公告)号：US11692241B2
公开(公告)日：2023-07-04
申请号：US16473353
申请日：2017-12-21
Applicant: Dowa Electronics Materials Co., Ltd.
Inventor： Masahiro Yoshida , Kenichi Inoue , Atsushi Ebara , Yoshiyuki Michiaki , Takahiro Yamada
CPC classification number: B22F9/082 , B22F1/10 , H01B1/22 , B22F2009/086 , B22F2009/0828 , B22F2009/0832 , B22F2201/013 , B22F2201/02 , B22F2201/04 , B22F2201/11 , B22F2203/13 , B22F2301/10 , B22F2303/01 , B22F2304/10 , B22F2998/10
Abstract: While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
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Patent Agency Ranking
公开(公告)号：US11407030B2
公开(公告)日：2022-08-09
申请号：US17086552
申请日：2020-11-02
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Atsushi Ebara , Kenichi Inoue , Yoshiyuki Michiaki , Takahiro Yamada , Masahiro Yoshida
IPC: H01B1/02 , C09D5/24 , B22F9/08 , C22C5/06 , H01B1/22 , B22F1/00 , B22F1/05 , C09D7/40 , C08K3/08
Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%).
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公开(公告)号：US10170213B2
公开(公告)日：2019-01-01
申请号：US15859909
申请日：2018-01-02
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiyuki Michiaki , Hiroshi Kamiga
IPC: H01B1/22 , H01L31/0224 , C09D5/24 , C09D101/28 , B22F1/00 , C08K9/04 , B22F9/24
Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
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公开(公告)号：US11420256B2
公开(公告)日：2022-08-23
申请号：US16648423
申请日：2018-09-18
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiyuki Michiaki , Masahiro Yoshida , Kenichi Inoue
Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.1% by weight or less of oxygen and wherein the particle diameter (D50 diameter) corresponding to 50% of accumulation in volume-based cumulative distribution of the silver powder, which is measured by means of a laser diffraction particle size analyzer, is in the range of from 1 μm to 15 μm, the average particle diameter (SEM diameter) of single particles being in the range of from 1 μm to 8 μm when it is measured by means of a field emission scanning electron microscope (SEM), the ratio (SEM diameter/D50 diameter) of the SEM diameter to the D50 diameter being in the range of from 0.3 to 1.0.
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公开(公告)号：US20200238388A1
公开(公告)日：2020-07-30
申请号：US16648423
申请日：2018-09-18
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiyuki Michiaki , Masahiro Yoshida , Kenichi Inoue
Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.1% by weight or less of oxygen and wherein the particle diameter (D50 diameter) corresponding to 50% of accumulation in volume-based cumulative distribution of the silver powder, which is measured by means of a laser diffraction particle size analyzer, is in the range of from 1 μm to 15 μm, the average particle diameter (SEM diameter) of single particles being in the range of from 1 μm to 8 μm when it is measured by means of a field emission scanning electron microscope (SEM), the ratio (SEM diameter/D50 diameter) of the SEM diameter to the D50 diameter being in the range of from 0.3 to 1.0.
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公开(公告)号：US09984788B2
公开(公告)日：2018-05-29
申请号：US15326536
申请日：2015-07-24
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiyuki Michiaki , Hiroshi Kamiga
IPC: H01B1/22 , H01L31/0224 , C09D101/28 , B22F1/00 , C09D5/24 , C08K9/04
CPC classification number: H01B1/22 , B22F1/0062 , B22F9/24 , B22F2301/255 , B22F2302/45 , B22F2998/10 , C08K9/04 , C08K2201/001 , C09D5/24 , C09D101/28 , H01L31/022425 , B22F2001/0066
Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
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