公开(公告)号：US10773311B2

公开(公告)日：2020-09-15

申请号：US15757427

申请日：2016-08-18

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Kenichi Inoue ,  Atsushi Ebara ,  Masahiro Yoshida ,  Kyoso Masuda ,  Takahiro Yamada ,  Shinichi Uchiyama

IPC: B32B5/16 ,  B22F9/08 ,  C22C9/00 ,  B22F1/00 ,  H01B1/02 ,  H01B1/06 ,  B22F1/02 ,  H01L23/00

Abstract: An object of the present invention is to provide a phosphorus-containing copper powder with good volume resistivity and a small carbon content by suppressing an oxygen content to a relatively low value even if a particle size is made small, and a method for producing the same. In the phosphorus-containing copper powder containing phosphorus, a ratio of an oxygen content (wt. %) to a BET specific surface area (m2/g) (oxygen content/BET specific surface area) is 0.90 wt. %·g/m2 or less, a divalent copper compound is present on a surface of particles constituting the phosphorus-containing copper powder, a carbon content is 0.10 wt. % or less, and D50 is 7.11 μm or less.

公开(公告)号：US11420256B2

公开(公告)日：2022-08-23

申请号：US16648423

申请日：2018-09-18

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Yoshiyuki Michiaki ,  Masahiro Yoshida ,  Kenichi Inoue

IPC: B22F1/10 ,  B22F9/08 ,  B22F1/05 ,  C22C5/08 ,  C23C2/28

Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.1% by weight or less of oxygen and wherein the particle diameter (D50 diameter) corresponding to 50% of accumulation in volume-based cumulative distribution of the silver powder, which is measured by means of a laser diffraction particle size analyzer, is in the range of from 1 μm to 15 μm, the average particle diameter (SEM diameter) of single particles being in the range of from 1 μm to 8 μm when it is measured by means of a field emission scanning electron microscope (SEM), the ratio (SEM diameter/D50 diameter) of the SEM diameter to the D50 diameter being in the range of from 0.3 to 1.0.

公开(公告)号：US20200238388A1

公开(公告)日：2020-07-30

申请号：US16648423

申请日：2018-09-18

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Yoshiyuki Michiaki ,  Masahiro Yoshida ,  Kenichi Inoue

IPC: B22F9/08 ,  B22F1/00

Abstract: A silver powder which has a small content of carbon and which is difficult to be agglutinated, and a method for producing the same. While a molten metal, which is prepared by melting silver to which 40 ppm or more of copper is added, is allowed to drop, a high-pressure water is sprayed onto the molten metal to rapidly cool and solidify the molten metal to produce a silver powder which contains 40 ppm or more of copper, 0.1% by weight or less of carbon and 0.1% by weight or less of oxygen and wherein the particle diameter (D50 diameter) corresponding to 50% of accumulation in volume-based cumulative distribution of the silver powder, which is measured by means of a laser diffraction particle size analyzer, is in the range of from 1 μm to 15 μm, the average particle diameter (SEM diameter) of single particles being in the range of from 1 μm to 8 μm when it is measured by means of a field emission scanning electron microscope (SEM), the ratio (SEM diameter/D50 diameter) of the SEM diameter to the D50 diameter being in the range of from 0.3 to 1.0.

公开(公告)号：US20140346413A1

公开(公告)日：2014-11-27

申请号：US14372789

申请日：2013-01-15

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Kenichi Inoue ,  Kozo Ogi ,  Atsushi Ebara ,  Yuto Hiyama ,  Takahiro Yamada ,  Toshihiko Ueyama

IPC: H01B1/22

CPC classification number: H01B1/22 ,  B22F1/0011 ,  B22F1/0074 ,  B22F1/025 ,  B22F9/082 ,  C22C1/0425 ,  C22C5/06 ,  C22C9/04 ,  C22C9/06 ,  H01B1/026 ,  Y10T428/2991

Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 μm), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.

Abstract translation: 通过涂覆铜合金粉末，其具有体积电阻率低和储存稳定性（可靠性）优异的银涂层铜合金粉末，其具有包含镍和锌中的至少一种的1至50重量％的化学组成 余量为铜和不可避免的杂质（优选为通过激光衍射式粒度分析仪测定的铜合金粉末的累积分布中累积分布的50％的粒径（D50直径）为0.1的铜合金粉末为0.1 至15μm），含有7至50wt％的含银层，优选银或银化合物层。

公开(公告)号：US12049684B2

公开(公告)日：2024-07-30

申请号：US18196614

申请日：2023-05-12

Applicant: Dowa Electronics Materials Co., Ltd.

Inventor： Masahiro Yoshida ,  Kenichi Inoue ,  Atsushi Ebara ,  Yoshiyuki Michiaki ,  Takahiro Yamada

IPC: B22F1/10 ,  B22F1/05 ,  B22F9/08 ,  C22C1/04 ,  H01B1/22 ,  B22F1/00

CPC classification number: C22C1/0425 ,  B22F1/05 ,  B22F1/10 ,  B22F9/082 ,  H01B1/22 ,  B22F1/09 ,  B22F2009/0828 ,  B22F2009/0832 ,  B22F2009/086 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2201/04 ,  B22F2201/11 ,  B22F2203/13 ,  B22F2301/10 ,  B22F2303/01 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  B22F1/10 ,  C22C1/0425 ,  B22F1/05

Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

公开(公告)号：US20230279523A1

公开(公告)日：2023-09-07

申请号：US18196614

申请日：2023-05-12

Applicant: Dowa Electronics Materials Co., Ltd.

Inventor： Masahiro Yoshida ,  Kenichi Inoue ,  Atsushi Ebara ,  Yoshiyuki Michiaki ,  Takahiro Yamada

IPC: C22C1/04 ,  B22F9/08 ,  H01B1/22 ,  B22F1/10 ,  B22F1/05

CPC classification number: C22C1/0425 ,  B22F9/082 ,  H01B1/22 ,  B22F1/10 ,  B22F1/05 ,  B22F2009/0828 ,  B22F2009/0832 ,  B22F2009/086 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2201/04 ,  B22F2201/11 ,  B22F2203/13 ,  B22F2301/10 ,  B22F2303/01 ,  B22F2304/10 ,  B22F2998/10 ,  B22F1/09

Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

公开(公告)号：US11692241B2

公开(公告)日：2023-07-04

申请号：US16473353

申请日：2017-12-21

Applicant: Dowa Electronics Materials Co., Ltd.

Inventor： Masahiro Yoshida ,  Kenichi Inoue ,  Atsushi Ebara ,  Yoshiyuki Michiaki ,  Takahiro Yamada

IPC: H01B1/22 ,  B22F1/10 ,  B22F9/08

CPC classification number: B22F9/082 ,  B22F1/10 ,  H01B1/22 ,  B22F2009/086 ,  B22F2009/0828 ,  B22F2009/0832 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2201/04 ,  B22F2201/11 ,  B22F2203/13 ,  B22F2301/10 ,  B22F2303/01 ,  B22F2304/10 ,  B22F2998/10

Abstract: While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 μm and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.

公开(公告)号：US11407030B2

公开(公告)日：2022-08-09

申请号：US17086552

申请日：2020-11-02

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Atsushi Ebara ,  Kenichi Inoue ,  Yoshiyuki Michiaki ,  Takahiro Yamada ,  Masahiro Yoshida

IPC: H01B1/02 ,  C09D5/24 ,  B22F9/08 ,  C22C5/06 ,  H01B1/22 ,  B22F1/00 ,  B22F1/05 ,  C09D7/40 ,  C08K3/08

Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%).

公开(公告)号：US10458004B2

公开(公告)日：2019-10-29

申请号：US14918948

申请日：2015-10-21

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Kozo Ogi ,  Kenichi Inoue ,  Atsushi Ebara ,  Akihiro Asano ,  Hideyuki Fujimoto ,  Takahiro Yamada

IPC: C22C12/00 ,  H05K1/09 ,  B22F1/00 ,  H01B1/22 ,  C22C5/06 ,  B22F9/08

Abstract: To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.

公开(公告)号：US11041229B2

公开(公告)日：2021-06-22

申请号：US16329069

申请日：2017-08-31

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Kyoso Masuda ,  Kenichi Inoue ,  Yuki Kaneshiro ,  Atsushi Ebara ,  Yoshiyuki Michiaki ,  Kozo Ogi ,  Takahiro Yamada ,  Masahiro Yoshida

IPC: B32B5/16 ,  C22C9/06 ,  B22F1/00 ,  H01G4/232 ,  H01B5/00 ,  H01B1/00 ,  C22C9/00 ,  H01G4/30 ,  C22C9/04 ,  B22F1/02 ,  H01B1/22 ,  H01G4/228 ,  H05K1/09

Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.