Invention Grant
- Patent Title: Calibration sample, electron beam adjustment method and electron beam apparatus using same
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Application No.: US16638634Application Date: 2017-08-25
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Publication No.: US11435178B2Publication Date: 2022-09-06
- Inventor: Yasunari Sohda , Yoshinori Nakayama , Kaori Bizen , Hiroya Ohta , Yusuke Abe
- Applicant: HITACHI HIGH-TECH CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- International Application: PCT/JP2017/030563 WO 20170825
- International Announcement: WO2019/038917 WO 20190228
- Main IPC: G01B15/00
- IPC: G01B15/00 ; H01J37/10 ; H01J37/147 ; H01J37/20 ; H01J37/244 ; H01J37/28

Abstract:
To implement a calibration sample by which an incident angle can be measured with high accuracy, an electron beam adjustment method, and an electron beam apparatus using the calibration sample. To adjust an electron beam using a calibration sample, the calibration sample includes a silicon single crystal substrate 201 whose upper surface is a {110} plane, a first recess structure 202 opening in the upper surface and extending in a first direction, and a second recess structure 203 opening in the upper surface and extending in a second direction intersecting the first direction, in which the first recess structure and the second recess structure each include a first side surface and a first bottom surface that intersects the first side surface, and a second side surface and a second bottom surface that intersects the second side surface, the first side surface and the second side surface are {111} planes, and the first bottom surface and the second bottom surface are crystal planes different from the {110} planes.
Public/Granted literature
- US20210131801A1 CALIBRATION SAMPLE, ELECTRON BEAM ADJUSTMENT METHOD AND ELECTRON BEAM APPARATUS USING SAME Public/Granted day:2021-05-06
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