Invention Grant
- Patent Title: Structures with deformable conductors
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Application No.: US17395130Application Date: 2021-08-05
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Publication No.: US11594480B2Publication Date: 2023-02-28
- Inventor: Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
- Applicant: Liquid Wire Inc.
- Applicant Address: US OR Portland
- Assignee: Liquid Wire Inc.
- Current Assignee: Liquid Wire Inc.
- Current Assignee Address: US OR Portland
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L21/48
Abstract:
A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
Public/Granted literature
- US20220068787A1 Structures With Deformable Conductors Public/Granted day:2022-03-03
Information query
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