公开(公告)号：US12096563B2

公开(公告)日：2024-09-17

申请号：US17446598

申请日：2021-08-31

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Katherine M. Nelson ,  Charles J. Kinzel

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/14 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/189 ,  H05K1/0283 ,  H05K1/147 ,  H05K1/092 ,  H05K1/115 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/049 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10219

Abstract: A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.

公开(公告)号：US20250151201A1

公开(公告)日：2025-05-08

申请号：US18883882

申请日：2024-09-12

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Katherine M. Nelson ,  Charles J. Kinzel

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14

Abstract: A flexible hybrid electronic system includes a first structure electrically coupled to a second structure through a via. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from a fluid phase conductor and enclosed within the first flexible substrate. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from the fluid phase conductor and enclosed within the second flexible substrate. The via is filled with a conductive medium and extends between and electrically couples the first flexible conductive trace to the second flexible conductive trace. The first structure is bonded to the second structure at an interconnect region and the via is located within the interconnect region.

公开(公告)号：US20240021337A1

公开(公告)日：2024-01-18

申请号：US18256257

申请日：2021-12-10

Applicant: Liquid Wire Inc.

Inventor： Jesse Michael Martinez ,  Micheal Adventure Hopkins ,  Charles J. Kinzel ,  Trevor Antonio Rivera ,  Mark William Ronay ,  Edward Martin Godshalk

IPC: H01B1/22 ,  H01B7/00 ,  H01B3/48 ,  H01B3/40 ,  H01B13/00 ,  H01B19/04

CPC classification number: H01B1/22 ,  H01B7/0027 ,  H01B3/48 ,  H01B3/40 ,  H01B13/0036 ,  H01B19/04

Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.

公开(公告)号：US11594480B2

公开(公告)日：2023-02-28

申请号：US17395130

申请日：2021-08-05

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US12205878B2

公开(公告)日：2025-01-21

申请号：US18316586

申请日：2023-05-12

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/48 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/52

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US12125778B2

公开(公告)日：2024-10-22

申请号：US18440381

申请日：2024-02-13

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/49861 ,  H01L21/4846

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US11955420B2

公开(公告)日：2024-04-09

申请号：US18114420

申请日：2023-02-27

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/49861 ,  H01L21/4846

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US11688677B2

公开(公告)日：2023-06-27

申请号：US17303030

申请日：2021-05-18

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H01L21/485 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20220071014A1

公开(公告)日：2022-03-03

申请号：US17446598

申请日：2021-08-31

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Katherine M. Nelson ,  Charles J. Kinzel

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/02

Abstract: A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.

公开(公告)号：US20240389225A1

公开(公告)日：2024-11-21

申请号：US18683738

申请日：2022-08-15

Applicant: Liquid Wire Inc.

Inventor： Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Charles J. Kinzel ,  Mark William Ronay

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/46

Abstract: An apparatus comprises a metal layer 102, a fluid phase conductor 202 configured to overlap at least a portion of the metal layer, a stencil layer 204 having vias or channels containing the fluid phase conductor, and an encapsulation layer 206 configured to encapsulate the fluid phase conductor within the apparatus.