Invention Grant
- Patent Title: Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer
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Application No.: US17425023Application Date: 2020-02-11
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Publication No.: US11596070B2Publication Date: 2023-02-28
- Inventor: Nava Shpaisman , Abraham Gross , Arie Glazer
- Applicant: Orbotech Ltd.
- Applicant Address: IL Yavne
- Assignee: Orbotech Ltd.
- Current Assignee: Orbotech Ltd.
- Current Assignee Address: IL Yavne
- Agency: Hodgson Russ LLP
- International Application: PCT/IL2020/050160 WO 20200211
- International Announcement: WO2020/165897 WO 20200820
- Main IPC: H05K3/06
- IPC: H05K3/06 ; H05K3/12 ; H05K3/00 ; C09D11/30

Abstract:
An apparatus is used in preparing a printed circuit board (PCB). The apparatus can include a common chassis, an inkjet printer mounted on the common chassis, and a pattern exposer mounted on the common chassis. The inkjet printer can selectively print unexposed photosensitive patterns on a PCB substrate with a photosensitive ink. The pattern exposer can expose said photosensitive patterns to radiation thereby defining exposed patterns. A photosensitive ink for use in an ink jet printer can include a photoresist, a solvent, a humectant, a surfactant, an adhesion promoter, and a basic solution. The adhesion promoter is operative to increase anisotropy of a wet etching process of a copper component on which said photosensitive ink is printed.
Public/Granted literature
- US20220104360A1 A Method and Apparatus for Preparing a PCB Product Having Highly Dense Conductors Public/Granted day:2022-03-31
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