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公开(公告)号：US20250146955A1
公开(公告)日：2025-05-08
申请号：US18618475
申请日：2024-03-27
Applicant: Orbotech Ltd.
Inventor： Elkana Porat , Ronen Yogev , Nava Shpaisman
IPC: G01N21/956 , G01J5/00 , G01J5/48 , G01N21/17 , G01N21/88
Abstract: The system includes a thermal subsystem, an optical subsystem, and a processor. The thermal subsystem comprises a first laser light source configured to emit laser light, a first focusing lens configured to direct the laser light onto a workpiece, and a thermal camera configured to capture a thermal image of the workpiece. The optical subsystem includes at least one light source configured to emit laser light with at least one illumination modality, at light focusing lens configured to direct the light onto the workpiece, and a detector configured to capture at least one image of the workpiece. The processor is configured to compare the at least one image received from the detector to at least one reference image for registration of the workpiece or to determine presence of a surface defect on the workpiece, and to determine presence of a bulk defect in the workpiece based on the thermal image.
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公开(公告)号：US20240142958A1
公开(公告)日：2024-05-02
申请号：US17979386
申请日：2022-11-02
Applicant: Orbotech Ltd.
Inventor： Nava Shpaisman , Bronislav Kupershtein
IPC: G05B19/418 , G06T7/00
CPC classification number: G05B19/41875 , G06T7/0004 , G05B2219/32182 , G06T2207/30141
Abstract: A method for defect mitigation is disclosed. The method may include receiving defect data for one or more defects of one or more samples. The defect data may include a defect location, a defect size, a defect shape, or a relationship between the defect and a component of the one or more samples. The method may include identifying at least one defect as a disqualifying defect based on the received defect data and one or more predetermined thresholds. Upon identifying the defect as a disqualifying defect, the method may include generating a tool readable index configured to cause one or more downstream fabrications tool to adjust one or more downstream fabrication steps corresponding to the disqualifying defect based on the generated tool readable index. The method may include providing the generated tool readable index to the one or more downstream fabrication tool.
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公开(公告)号：US11596070B2
公开(公告)日：2023-02-28
申请号：US17425023
申请日：2020-02-11
Applicant: Orbotech Ltd.
Inventor： Nava Shpaisman , Abraham Gross , Arie Glazer
Abstract: An apparatus is used in preparing a printed circuit board (PCB). The apparatus can include a common chassis, an inkjet printer mounted on the common chassis, and a pattern exposer mounted on the common chassis. The inkjet printer can selectively print unexposed photosensitive patterns on a PCB substrate with a photosensitive ink. The pattern exposer can expose said photosensitive patterns to radiation thereby defining exposed patterns. A photosensitive ink for use in an ink jet printer can include a photoresist, a solvent, a humectant, a surfactant, an adhesion promoter, and a basic solution. The adhesion promoter is operative to increase anisotropy of a wet etching process of a copper component on which said photosensitive ink is printed.
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公开(公告)号：US20220104360A1
公开(公告)日：2022-03-31
申请号：US17425023
申请日：2020-02-11
Applicant: Orbotech Ltd.
Inventor： Nava Shpaisman , Abraham Gross , Arie Glazer
Abstract: A method for preparing a PCB product having highly dense conductors, the method including providing a PCB substrate including a conductive layer, employing an inkjet printer to selectively print unexposed photosensitive patterns on the PCB substrate, the unexposed photosensitive patterns having a thickness of less than 5 pm, exposing the photosensitive patterns to radiation thereby to define exposed patterns, the exposed patterns having a pitch less than 20 pm and wet etching the conductive layer in accordance with a pattern defined by the exposed patterns thereby to define the highly dense conductors having a pitch of less than 30 pm.
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