Invention Grant
- Patent Title: Top buffer layer for magnetic tunnel junction application
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Application No.: US17112484Application Date: 2020-12-04
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Publication No.: US11621393B2Publication Date: 2023-04-04
- Inventor: Lin Xue , Chando Park , Chi Hong Ching , Jaesoo Ahn , Mahendra Pakala
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L43/12
- IPC: H01L43/12 ; C23C14/06 ; C23C14/54 ; H01F10/32 ; H01F41/32 ; H01L43/10 ; H01L43/02 ; H01F10/13 ; H01L21/67 ; C23C14/00 ; H01F41/30 ; H01F10/30 ; G11C11/16

Abstract:
Embodiments of the disclosure provide methods and apparatus for fabricating magnetic tunnel junction (MTJ) structures on a substrate for MRAM applications. In one embodiment, a magnetic tunnel junction (MTJ) device structure includes a junction structure disposed on a substrate, the junction structure comprising a first ferromagnetic layer and a second ferromagnetic layer sandwiching a tunneling barrier layer, a dielectric capping layer disposed on the junction structure, a metal capping layer disposed on the junction structure, and a top buffer layer disposed on the metal capping layer.
Public/Granted literature
- US20210119119A1 TOP BUFFER LAYER FOR MAGNETIC TUNNEL JUNCTION APPLICATION Public/Granted day:2021-04-22
Information query
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