Invention Grant
- Patent Title: Steam cleaning of CMP components
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Application No.: US16886567Application Date: 2020-05-28
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Publication No.: US11628478B2Publication Date: 2023-04-18
- Inventor: Haosheng Wu , Jianshe Tang , Hari Soundararajan , Shou-Sung Chang , Hui Chen , Chih Chung Chou , Alexander John Fisher , Paul D. Butterfield
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B08B3/00
- IPC: B08B3/00 ; B08B3/10 ; H01L21/02 ; B08B1/00 ; B24B53/017 ; B24B37/20 ; H01L21/306
Abstract:
A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.
Public/Granted literature
- US20200376522A1 STEAM CLEANING OF CMP COMPONENTS Public/Granted day:2020-12-03
Information query
