公开(公告)号：US20210046604A1

公开(公告)日：2021-02-18

申请号：US16989734

申请日：2020-08-10

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Chih Chung Chou ,  Jianshe Tang ,  Hui Chen ,  Hari Soundararajan ,  Brian J. Brown

IPC: B24B37/015 ,  H01L21/321 ,  H01L21/67 ,  B24B57/02

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

公开(公告)号：US20210046603A1

公开(公告)日：2021-02-18

申请号：US16831664

申请日：2020-03-26

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B57/02 ,  B24B49/14

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of a heating fluid, a reservoir to hold a polishing liquid, and a dispenser having one or more apertures suspended over the platen to direct the polishing liquid onto the polishing surface, wherein the source of the heating fluid is coupled to the dispenser and configured to deliver the heating fluid into the polishing liquid to heat the polishing liquid after the polishing liquid leaves the reservoir and before the polishing liquid is dispensed onto the polishing surface.

公开(公告)号：US20200331113A1

公开(公告)日：2020-10-22

申请号：US16849863

申请日：2020-04-15

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B55/02 ,  B24B37/34

Abstract: A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.

公开(公告)号：US20250108476A1

公开(公告)日：2025-04-03

申请号：US18977686

申请日：2024-12-11

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Yen-Chu Yang ,  Jianshe Tang ,  Shou-Sung Chang ,  Shih-Haur Shen ,  Taketo Sekine

IPC: B24B37/015 ,  B24B37/10 ,  B24B49/02 ,  B24B49/04 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02

Abstract: A chemical mechanical polishing system includes a support to hold a polishing pad, a carrier head to hold a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature control system to control a temperature of the polishing process, and a controller coupled to the in-situ monitoring system and the temperature control system. The controller is configured to cause the temperature control system to vary the temperature of the polishing process in response to the signal.

公开(公告)号：US12030093B2

公开(公告)日：2024-07-09

申请号：US17889330

申请日：2022-08-16

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  B24B37/34 ,  H01L21/67

CPC classification number: B08B3/106 ,  B24B37/34 ,  H01L21/67051 ,  H01L21/67248 ,  B08B2203/007

Abstract: An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US11919123B2

公开(公告)日：2024-03-05

申请号：US17362802

申请日：2021-06-29

Applicant: Applied Materials, Inc.

Inventor： Surajit Kumar ,  Hari Soundararajan ,  Hui Chen ,  Shou-Sung Chang

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/26 ,  B24B41/047

CPC classification number: B24B37/015 ,  B24B37/107 ,  B24B37/26 ,  B24B41/047

Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.

公开(公告)号：US20230415296A1

公开(公告)日：2023-12-28

申请号：US18452062

申请日：2023-08-18

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung Chang ,  Hari Soundararajan ,  Haosheng Wu ,  Jianshe Tang

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.

公开(公告)号：US11833637B2

公开(公告)日：2023-12-05

申请号：US17360907

申请日：2021-06-28

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Calvin Lee ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Dmitry Sklyar ,  Paul D. Butterfield ,  Chad Pollard ,  Haosheng Wu

IPC: B24B37/015 ,  B24B37/04 ,  F22B35/00

CPC classification number: B24B37/015 ,  B24B37/042 ,  F22B35/00

Abstract: A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.

公开(公告)号：US11633833B2

公开(公告)日：2023-04-25

申请号：US16886238

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher

IPC: B24B53/017 ,  B24B53/00 ,  B24B57/02 ,  B24B41/06

Abstract: A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

公开(公告)号：US11628478B2

公开(公告)日：2023-04-18

申请号：US16886567

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/00 ,  B08B3/10 ,  H01L21/02 ,  B08B1/00 ,  B24B53/017 ,  B24B37/20 ,  H01L21/306

Abstract: A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.