公开(公告)号：US20250114909A1

公开(公告)日：2025-04-10

申请号：US18481761

申请日：2023-10-05

Applicant: Applied Materials, Inc.

Inventor： Priscilla Diep LaRosa ,  Chih Chung Chou ,  Haosheng Wu ,  Taketo Sekine ,  Chen-Wei Chang ,  Elton Zhong ,  Jianshe Tang ,  Songling Shin

IPC: B24B55/03 ,  B24B37/015 ,  B24B37/20

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid dispenser having a polishing liquid port positioned over the platen to deliver polishing liquid onto the polishing pad, a temperature control system including coolant liquid fluid reservoirs for containing coolant fluids, a thermal controller configured to control the temperature of the coolant fluid within the coolant fluid reservoirs, and a first dispenser having openings in fluid connection with the coolant fluid reservoirs, the openings positioned configured to spray an aerosolized coolant liquid directly onto the polishing pad, and a second dispenser having a coolant port in fluid connection with the coolant fluid reservoirs, the coolant port positioned over the platen and configured to flow a stream of coolant liquid directly onto the polishing pad.

公开(公告)号：US20230130235A1

公开(公告)日：2023-04-27

申请号：US17507704

申请日：2021-10-21

Applicant: Applied Materials, Inc.

Inventor： Chih Chung Chou ,  Anand Nilakantan Iyer ,  Ekaterina A. Mikhaylichenko ,  Christopher HeungGyun Lee ,  Shou-Sung Chang

IPC: B24B57/02

Abstract: Exemplary slurry delivery systems may include a slurry source. The systems may include a slurry line coupled with the slurry source. The systems may include a slurry dispensing nozzle. The nozzle may include a lumen having an inlet that is fluidly coupled with a slurry outlet of the slurry line. The nozzle may include a body defining a reservoir and an exit port. The reservoir may be fluidly coupled with a downstream end of the lumen. The exit port may be coupled with the reservoir. The nozzle may include a valve seat. The nozzle may include a valve member having a first surface positioned against the valve seat when in a closed position. The valve member may be movable to an open position in which the first surface is spaced apart from the valve seat. The nozzle may include an actuator coupled with a second surface of the valve member.

公开(公告)号：US20210046604A1

公开(公告)日：2021-02-18

申请号：US16989734

申请日：2020-08-10

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Chih Chung Chou ,  Jianshe Tang ,  Hui Chen ,  Hari Soundararajan ,  Brian J. Brown

IPC: B24B37/015 ,  H01L21/321 ,  H01L21/67 ,  B24B57/02

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

公开(公告)号：US12233505B2

公开(公告)日：2025-02-25

申请号：US18315467

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Chih Chung Chou ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/013 ,  B24B37/04

Abstract: A polishing pad includes a sensor assembly surrounded by a lower portion of the polishing pad, and an upper portion including a pad portion disposed on the assembly and at least a portion of a polishing layer disposed on the lower portion. The sensor assembly includes a lower body having a first pair of electrodes formed thereon, a polymer body having a second pair of electrodes formed thereon and aligned with the first pair of electrodes, and a pair of gaps between the first pair of electrodes and the second pair of electrodes.

公开(公告)号：US20240109163A1

公开(公告)日：2024-04-04

申请号：US18537574

申请日：2023-12-12

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Chih Chung Chou ,  Jianshe Tang ,  Hui Chen ,  Hari Soundararajan ,  Brian J. Brown

IPC: B24B37/015 ,  B24B57/02 ,  H01L21/321 ,  H01L21/67

CPC classification number: B24B37/015 ,  B24B57/02 ,  H01L21/3212 ,  H01L21/67248

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

公开(公告)号：US11865671B2

公开(公告)日：2024-01-09

申请号：US16849884

申请日：2020-04-15

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Chih Chung Chou ,  Hui Chen ,  Hari Soundararajan ,  Benjamin Cherian

IPC: B24B57/02 ,  H01L21/304 ,  B24B37/04 ,  B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02 ,  B24B53/017 ,  B24B49/14

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B37/042 ,  B24B37/105 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02 ,  H01L21/304 ,  B24B49/14 ,  B24B53/017

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.

公开(公告)号：US20230278164A1

公开(公告)日：2023-09-07

申请号：US18315467

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Chih Chung Chou ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/04 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/042 ,  B24B37/013

Abstract: A polishing pad includes a sensor assembly surrounded by a lower portion of the polishing pad, and an upper portion including a pad portion disposed on the assembly and at least a portion of a polishing layer disposed on the lower portion. The sensor assembly includes a lower body having a first pair of electrodes formed thereon, a polymer body having a second pair of electrodes formed thereon and aligned with the first pair of electrodes, and a pair of gaps between the first pair of electrodes and the second pair of electrodes.

公开(公告)号：US11577358B2

公开(公告)日：2023-02-14

申请号：US16932615

申请日：2020-07-17

Applicant: Applied Materials, Inc.

Inventor： Surajit Kumar ,  Hui Chen ,  Chih Chung Chou ,  Shou-Sung Chang

IPC: B24B49/00 ,  B24B37/015 ,  B24B37/34

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

公开(公告)号：US20200376626A1

公开(公告)日：2020-12-03

申请号：US16886238

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher

IPC: B24B53/017 ,  B24B57/02 ,  B24B53/00

Abstract: A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

公开(公告)号：US10434623B2

公开(公告)日：2019-10-08

申请号：US15456320

申请日：2017-03-10

Applicant: Applied Materials, Inc.

Inventor： Eric Lau ,  Hui Chen ,  King Yi Heung ,  Wei-Cheng Lee ,  Chih Chung Chou ,  Edwin C. Suarez ,  Garrett Ho Yee Sin ,  Charles C. Garretson ,  Jeonghoon Oh

IPC: B24B37/26 ,  B24B37/30

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.