Invention Grant
- Patent Title: Bounding volume hierarchy traversal
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Application No.: US17126499Application Date: 2020-12-18
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Publication No.: US11748935B2Publication Date: 2023-09-05
- Inventor: Skyler Jonathon Saleh , Ruijin Wu
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Volpe Koenig
- Main IPC: G06T15/06
- IPC: G06T15/06 ; G06T17/00 ; G06T15/00 ; G06T15/08

Abstract:
A technique for performing ray tracing operations is provided. The technique includes initiating bounding volume hierarchy traversal for a ray against geometry represented by a bounding volume hierarchy; identifying multiple nodes of the bonding volume hierarchy for concurrent intersection tests; and performing operations for the concurrent intersection tests concurrently.
Public/Granted literature
- US20210209832A1 BOUNDING VOLUME HIERARCHY TRAVERSAL Public/Granted day:2021-07-08
Information query
IPC分类:
G | 物理 |
G06 | 计算;推算或计数 |
G06T | 一般的图像数据处理或产生 |
G06T15/00 | 3D〔三维〕图像的加工 |
G06T15/06 | .光线跟踪 |