Invention Grant
- Patent Title: Forming high carbon content flowable dielectric film with low processing damage
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Application No.: US16251526Application Date: 2019-01-18
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Publication No.: US11756786B2Publication Date: 2023-09-12
- Inventor: Benjamin D. Briggs , Donald F. Canaperi , Huy Cao , Thomas J. Haigh, Jr. , Son Nguyen , Hosadurga Shobha , Devika Sil , Han You
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Peter Edwards
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/30 ; C23C16/56 ; H01L21/768 ; C23C16/48 ; B05D1/00 ; B05D3/06 ; B05D3/02

Abstract:
A method of fabricating a dielectric film includes depositing a first precursor on a substrate. The first precursor includes a cyclic carbosiloxane group comprising a six-membered ring. The method also includes depositing a second precursor on the substrate. The first precursor and the second precursor form a preliminary film on the substrate, and the second precursor includes silicon, carbon, and hydrogen. The method further includes exposing the preliminary film to energy from an energy source to form a porous dielectric film.
Public/Granted literature
- US20200234949A1 FORMING HIGH CARBON CONTENT FLOWABLE DIELECTRIC FILM WITH LOW PROCESSING DAMAGE Public/Granted day:2020-07-23
Information query
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