Invention Grant
- Patent Title: Method of forming a chip package and chip package
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Application No.: US17491647Application Date: 2021-10-01
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Publication No.: US11862600B2Publication Date: 2024-01-02
- Inventor: Thorsten Scharf , Alexander Heinrich , Steffen Jordan
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE 2020125813.5 2020.10.02
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H01L21/56 ; H01L23/498
Abstract:
A method of forming a chip package is provided. The method includes providing a malleable carrier with a layer of an electrically conductive material formed thereon, and positive fitting the malleable carrier to a chip to at least partially enclose the chip with the malleable carrier. The layer at least partially physically contacts the chip, such that the layer electrically contacts a chip contact of the chip. The layer forms a redistribution layer.
Public/Granted literature
- US20220108974A1 METHOD OF FORMING A CHIP PACKAGE AND CHIP PACKAGE Public/Granted day:2022-04-07
Information query
IPC分类:
