Invention Grant
- Patent Title: Method of manufacturing semiconductor structure having multi-work function gate electrode
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Application No.: US18301572Application Date: 2023-04-17
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Publication No.: US11943913B2Publication Date: 2024-03-26
- Inventor: Te-Hsuan Peng , Kai Jen , Mei-Yuan Chou
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- The original application number of the division: US17476006 2021.09.15
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
A semiconductor structure includes a substrate and a buried gate structure in the substrate. The buried gate structure includes a gate dielectric layer formed on the sidewall and the bottom surface of a trench in the substrate, a barrier layer formed in the trench and on the sidewall and the bottom surface of the gate dielectric layer, a first work function layer formed in the trench and including a main portion and a protruding portion, a second work function layer formed at opposite sides of the protruding portion, and an insulating layer formed in the trench and on the protruding portion of the first work function layer and the second work function layer. The barrier layer surrounds the main portion of the first work function layer. The area of the top surface of the protruding portion is less than the area of the bottom surface of the protruding portion.
Public/Granted literature
- US20230255020A1 METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING MULTI-WORK FUNCTION GATE ELECTRODE Public/Granted day:2023-08-10
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