Invention Grant
- Patent Title: Substrate processing apparatus, film formation unit, substrate processing method and film formation method
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Application No.: US17090983Application Date: 2020-11-06
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Publication No.: US11986853B2Publication Date: 2024-05-21
- Inventor: Yuji Tanaka , Masaya Asai , Masahiko Harumoto , Koji Kaneyama
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN HOLDINGS CO., LTD.
- Current Assignee: SCREEN HOLDINGS CO., LTD.
- Current Assignee Address: JP
- Agency: OSTROLENK FABER LLP
- Priority: JP 15112811 2015.06.03 JP 15220497 2015.11.10
- The original application number of the division: US15579505
- Main IPC: B05D1/00
- IPC: B05D1/00 ; B05C11/08 ; B05C11/10 ; B05D1/36 ; B05D3/00 ; C23F1/00 ; C23F1/08 ; H01L21/67 ; H01L21/677 ; H01L21/687
Abstract:
A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.
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