Invention Grant
- Patent Title: Coating film forming method and coating film forming apparatus
-
Application No.: US17274560Application Date: 2019-08-28
-
Publication No.: US12036573B2Publication Date: 2024-07-16
- Inventor: Shougo Inaba
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP 18168965 2018.09.10
- International Application: PCT/JP2019/033719 2019.08.28
- International Announcement: WO2020/054424A 2020.03.19
- Date entered country: 2021-03-09
- Main IPC: B05C11/08
- IPC: B05C11/08 ; B05C11/02 ; B05D1/00 ; B05D3/04 ; H01L21/67

Abstract:
A coating film forming method includes holding a substrate by a substrate holder; forming an air flow on a front surface of the substrate; supplying a coating liquid configured to form a coating film on the front surface; forming, after moving a covering member from a first position to a second position relatively to the substrate, the air flow in a gap formed by the covering member placed at the second position and the front surface of the substrate being rotated at a first rotation number such that a flow velocity of the air flow becomes larger than that of the air flow obtained when the covering member is placed at the first position; and rotating the substrate at a second rotation number higher than the first rotation number to adjust a film thickness distribution of the coating film by scattering the coating liquid from a peripheral portion thereof.
Public/Granted literature
- US20220055063A1 COATING FILM FORMING METHOD AND COATING FILM FORMING APPARATUS Public/Granted day:2022-02-24
Information query
IPC分类: