LAYER STRUCTURE INCLUDING DIELECTRIC LAYER, METHODS OF MANUFACTURING THE LAYER STRUCTURE, AND ELECTRONIC DEVICE INCLUDING THE LAYER STRUCTURE
Abstract:
A layer structure including a dielectric layer, a method of manufacturing the layer structure, and an electronic device including the layer structure are disclosed. The layer structure including a lower layer, a dielectric layer, and an upper layer sequentially stacked. The dielectric layer includes sequentially stacked first, second, and third layers, wherein one of the first layer or the third layer is a ferroelectric, the other one is an antiferroelectric, and the second layer is an oxide layer. In one example, the dielectric layer may further include a fourth layer on the third layer.
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