Invention Grant
- Patent Title: Substrate processing system and method of controlling the same
- Patent Title (中): 基板处理系统及其控制方法
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Application No.: US11472358Application Date: 2006-06-22
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Publication No.: US07694649B2Publication Date: 2010-04-13
- Inventor: Yoshio Kimura , Takahiro Okubo
- Applicant: Yoshio Kimura , Takahiro Okubo
- Applicant Address: JP Tokyo-To
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo-To
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-184296 20050624
- Main IPC: B05C11/00
- IPC: B05C11/00 ; B05C13/02 ; B05B7/06 ; B05B17/00

Abstract:
A process system includes a plurality of processing modules each processing a substrate with a process liquid. There is disposed a dispensing mechanism that dispenses the process liquid to the vertically arranged modules. The dispensing mechanism is provided with a process liquid supply source, and pumps corresponding to the respective processing modules. Each pump temporarily stores therein the process liquid which has been pressure-fed through a riser piping from the process liquid supply source by a pressing apparatus, and delivers the process liquid from an outlet. There are disposed nozzles each having a discharge port and discharging the process liquid to the corresponding processing module. Delivery pipings connecting the outlets of the pumps with the discharge ports of the corresponding nozzles have identical length to each other.
Public/Granted literature
- US20070095278A1 Substrate processing system and method of controlling the same Public/Granted day:2007-05-03
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