Invention Grant
- Patent Title: Substrate carrying apparatus having circumferential sidewall and substrate processing system
- Patent Title (中): 具有圆周侧壁和基板处理系统的基板承载装置
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Application No.: US12698455Application Date: 2010-02-02
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Publication No.: US08434423B2Publication Date: 2013-05-07
- Inventor: Takayuki Toshima , Kazuo Terada
- Applicant: Takayuki Toshima , Kazuo Terada
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2009-024025 20090204
- Main IPC: B05C13/00
- IPC: B05C13/00 ; B05C11/00 ; B05C3/00 ; C23C16/00 ; G03D5/00 ; B08B6/00 ; C23F1/00

Abstract:
Disclosed is a substrate carrying apparatus having a simple configuration capable of inhibiting the occurrence of pattern collapse. A carrying tray of the disclosed substrate carrying apparatus includes a bottom plate for supporting the substrate and a circumferential side wall being provided around the bottom plate. An opening is formed in the bottom plate. An elevating member, to and from which the substrate is to be transferred, passes through the opening. A space is temporarily formed in a carrying tray. The elevating member within the opening passes to the outside of the carrying tray through the space. When the substrate is carried, the liquid is reservoired within the carrying tray, and the substrate is carried while the liquid remained on the upper surface of the substrate.
Public/Granted literature
- US20100192992A1 SUBSTRATE CARRYING APPARATUS AND SUBSTRATE PROCESSING SYSTEM Public/Granted day:2010-08-05
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